XCZU6CG-2FFVC900I

Xilinx Inc. XCZU6CG-2FFVC900I

Part Number:
XCZU6CG-2FFVC900I
Manufacturer:
Xilinx Inc.
Ventron No:
3162956-XCZU6CG-2FFVC900I
Description:
IC FPGA 204 I/O 900FCBGA
ECAD Model:
Datasheet:
XCZU6CG-2FFVC900I

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Specifications
Xilinx Inc. XCZU6CG-2FFVC900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU6CG-2FFVC900I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    900
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.85V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B900
  • Supply Voltage-Max (Vsup)
    0.876V
  • Supply Voltage-Min (Vsup)
    0.825V
  • Number of I/O
    204
  • Speed
    533MHz, 1.3GHz
  • RAM Size
    256KB
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 469K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Surface Mount technology used in the Zynq® UltraScale ™ MPSoC CG series, published in 2016, offers a wide operating temperature range of -40°C~100°C TJ, making it suitable for various industrial applications. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), this MPSoC can withstand harsh environments and ensure reliable performance. It boasts a high number of I/O, with 204 available, allowing for versatile connectivity options. The core processor is a powerful Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, accompanied by a Dual ARM® Cortex™-R5 with CoreSight™ for efficient processing. The peripherals, including DMA, WDT, and various connectivity options such as CANbus, EBI/EMI, and USB OTG, add to the versatility of this MPSoC. The primary attribute of this device is the Zynq® UltraScale ™ FPGA with a whopping 469K logic cells, providing a highly customizable and flexible solution for complex applications.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.
XCZU6CG-2FFVC900I System On Chip (SoC) applications.

Remote control
Efficient hardware for inference of neural networks
Cyberphysical system-on-chip
System-on-chip (SoC)
Industrial automation devices
Apple smart watch
Medical Pressure
POS Terminals
Smartphones
Functional safety for critical applications in the automotive
XCZU6CG-2FFVC900I More Descriptions
FPGA Zynq UltraScale Family 469446 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 533MHz 1.3GHz 0.85V
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 469K, C900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU6CG-2FFVC900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Additional Feature
    View Compare
  • XCZU6CG-2FFVC900I
    XCZU6CG-2FFVC900I
    11 Weeks
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    900
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.85V
    NOT SPECIFIED
    R-PBGA-B900
    0.876V
    0.825V
    204
    533MHz, 1.3GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 469K Logic Cells
    ROHS3 Compliant
    -
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    -
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    625
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B625
    0.742V
    0.698V
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
  • XCZU7EV-1FBVB900E
    11 Weeks
    900-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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