Xilinx Inc. XCZU6CG-2FFVC900I
- Part Number:
- XCZU6CG-2FFVC900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162956-XCZU6CG-2FFVC900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU6CG-2FFVC900I
Xilinx Inc. XCZU6CG-2FFVC900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU6CG-2FFVC900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.85V
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B900
- Supply Voltage-Max (Vsup)0.876V
- Supply Voltage-Min (Vsup)0.825V
- Number of I/O204
- Speed533MHz, 1.3GHz
- RAM Size256KB
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 469K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Surface Mount technology used in the Zynq® UltraScale ™ MPSoC CG series, published in 2016, offers a wide operating temperature range of -40°C~100°C TJ, making it suitable for various industrial applications. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), this MPSoC can withstand harsh environments and ensure reliable performance. It boasts a high number of I/O, with 204 available, allowing for versatile connectivity options. The core processor is a powerful Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, accompanied by a Dual ARM® Cortex™-R5 with CoreSight™ for efficient processing. The peripherals, including DMA, WDT, and various connectivity options such as CANbus, EBI/EMI, and USB OTG, add to the versatility of this MPSoC. The primary attribute of this device is the Zynq® UltraScale ™ FPGA with a whopping 469K logic cells, providing a highly customizable and flexible solution for complex applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU6CG-2FFVC900I System On Chip (SoC) applications.
Remote control
Efficient hardware for inference of neural networks
Cyberphysical system-on-chip
System-on-chip (SoC)
Industrial automation devices
Apple smart watch
Medical Pressure
POS Terminals
Smartphones
Functional safety for critical applications in the automotive
The Surface Mount technology used in the Zynq® UltraScale ™ MPSoC CG series, published in 2016, offers a wide operating temperature range of -40°C~100°C TJ, making it suitable for various industrial applications. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), this MPSoC can withstand harsh environments and ensure reliable performance. It boasts a high number of I/O, with 204 available, allowing for versatile connectivity options. The core processor is a powerful Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, accompanied by a Dual ARM® Cortex™-R5 with CoreSight™ for efficient processing. The peripherals, including DMA, WDT, and various connectivity options such as CANbus, EBI/EMI, and USB OTG, add to the versatility of this MPSoC. The primary attribute of this device is the Zynq® UltraScale ™ FPGA with a whopping 469K logic cells, providing a highly customizable and flexible solution for complex applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU6CG-2FFVC900I System On Chip (SoC) applications.
Remote control
Efficient hardware for inference of neural networks
Cyberphysical system-on-chip
System-on-chip (SoC)
Industrial automation devices
Apple smart watch
Medical Pressure
POS Terminals
Smartphones
Functional safety for critical applications in the automotive
XCZU6CG-2FFVC900I More Descriptions
FPGA Zynq UltraScale Family 469446 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 533MHz 1.3GHz 0.85V
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 469K, C900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
FPGA - Field Programmable Gate Array
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 533MHz 1.3GHz 0.85V
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 469K, C900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU6CG-2FFVC900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeuPs/uCs/Peripheral ICs TypeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusAdditional FeatureView Compare
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XCZU6CG-2FFVC900I11 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)9008542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.85VNOT SPECIFIEDR-PBGA-B9000.876V0.825V204533MHz, 1.3GHz256KBMICROPROCESSOR CIRCUITDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 469K Logic CellsROHS3 Compliant--
-
11 Weeks625-BFBGA, FCBGAYES-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)6258542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B6250.742V0.698V180500MHz, 600MHz, 1.2GHz256KBMICROPROCESSOR CIRCUITQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
-
11 Weeks900-BBGA, FCBGA-0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)-8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED---204500MHz, 600MHz, 1.2GHz256KB-Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-
-
11 Weeks1517-BBGA, FCBGA--40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)-8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED---464533MHz, 600MHz, 1.3GHz256KB-Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-
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