XCZU5EV-2SFVC784E

Xilinx Inc. XCZU5EV-2SFVC784E

Part Number:
XCZU5EV-2SFVC784E
Manufacturer:
Xilinx Inc.
Ventron No:
3669349-XCZU5EV-2SFVC784E
Description:
IC FPGA 252 I/O 784FCBGA
ECAD Model:
Datasheet:
XCZU5EV-2SFVC784E

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Specifications
Xilinx Inc. XCZU5EV-2SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EV-2SFVC784E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    784-BFBGA, FCBGA
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC EV
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    252
  • Speed
    533MHz, 600MHz, 1.3GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.It has been assigned a package 784-BFBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.The Zynq? UltraScale ? MPSoC EV series contains this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale ? FPGA, 256K Logic Cells.An advanced Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 252 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU5EV-2SFVC784E System On Chip (SoC) applications.

Measurement testers
Wireless networking
AC-input BLDC motor drive
Three phase UPS
Efficient hardware for inference of neural networks
Functional safety for critical applications in the automotive
ARM Cortex M4 microcontroller
Industrial automation devices
Smartphone accessories
Samsung galaxy gear
XCZU5EV-2SFVC784E More Descriptions
FPGA Zynq UltraScale 256200 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 256K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU5EV-2SFVC784E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    View Compare
  • XCZU5EV-2SFVC784E
    XCZU5EV-2SFVC784E
    11 Weeks
    784-BFBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    yes
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    252
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    -40°C~100°C TJ
    Tray
    -
    Zynq® UltraScale ™ MPSoC EG
    -
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    YES
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B625
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
  • XCZU9EG-1FFVC900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC EG
    -
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    -
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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