Xilinx Inc. XCZU5EV-1SFVC784E
- Part Number:
- XCZU5EV-1SFVC784E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669358-XCZU5EV-1SFVC784E
- Description:
- IC FPGA 252 I/O 784FCBGA
- Datasheet:
- XCZU5EV-1SFVC784E
Xilinx Inc. XCZU5EV-1SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EV-1SFVC784E.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Supplier Device Package784-FCBGA (23x23)
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EV
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of I/O252
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 256K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case for this product is 784-BFBGA or FCBGA. The supplier device package is 784-FCBGA with dimensions of 23x23. It was published in 2016 and is part of the Zynq® UltraScale ™ MPSoC EV series. The product is currently active and has a moisture sensitivity level of 4, meaning it can withstand 72 hours of exposure to moisture. It has a total of 252 I/Os and can operate at speeds of 500MHz, 600MHz, and 1.2GHz. Some of its peripherals include DMA and WDT, and it has a combined architecture of MCU and FPGA.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EV-1SFVC784E System On Chip (SoC) applications.
AC-input BLDC motor drive
String inverter
PC peripherals
Transmitters
Industrial sectors
Body control module
Optical drive
Multiprocessor system-on-chips (MPSoCs)
Apple smart watch
Published Paper
The package or case for this product is 784-BFBGA or FCBGA. The supplier device package is 784-FCBGA with dimensions of 23x23. It was published in 2016 and is part of the Zynq® UltraScale ™ MPSoC EV series. The product is currently active and has a moisture sensitivity level of 4, meaning it can withstand 72 hours of exposure to moisture. It has a total of 252 I/Os and can operate at speeds of 500MHz, 600MHz, and 1.2GHz. Some of its peripherals include DMA and WDT, and it has a combined architecture of MCU and FPGA.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EV-1SFVC784E System On Chip (SoC) applications.
AC-input BLDC motor drive
String inverter
PC peripherals
Transmitters
Industrial sectors
Body control module
Optical drive
Multiprocessor system-on-chips (MPSoCs)
Apple smart watch
Published Paper
XCZU5EV-1SFVC784E More Descriptions
FPGA Zynq UltraScale Family 256200 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 256K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
IC SOC CORTEX-A9 667MHZ 676FCBGA
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 256K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
IC SOC CORTEX-A9 667MHZ 676FCBGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU5EV-1SFVC784E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeHTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Surface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU5EV-1SFVC784E11 Weeks784-BFBGA, FCBGA784-FCBGA (23x23)0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)252500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant----------------
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11 Weeks1156-BBGA, FCBGA-0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes8542.31.00.01NOT SPECIFIEDNOT SPECIFIED-----------
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11 Weeks625-BFBGA, FCBGA--40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 Compliant-8542.31.00.01NOT SPECIFIEDNOT SPECIFIEDYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant-8542.31.00.01NOT SPECIFIEDNOT SPECIFIED-----------
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