XCZU5EV-1SFVC784E

Xilinx Inc. XCZU5EV-1SFVC784E

Part Number:
XCZU5EV-1SFVC784E
Manufacturer:
Xilinx Inc.
Ventron No:
3669358-XCZU5EV-1SFVC784E
Description:
IC FPGA 252 I/O 784FCBGA
ECAD Model:
Datasheet:
XCZU5EV-1SFVC784E

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Specifications
Xilinx Inc. XCZU5EV-1SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EV-1SFVC784E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    784-BFBGA, FCBGA
  • Supplier Device Package
    784-FCBGA (23x23)
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC EV
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of I/O
    252
  • Speed
    500MHz, 600MHz, 1.2GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case for this product is 784-BFBGA or FCBGA. The supplier device package is 784-FCBGA with dimensions of 23x23. It was published in 2016 and is part of the Zynq® UltraScale ™ MPSoC EV series. The product is currently active and has a moisture sensitivity level of 4, meaning it can withstand 72 hours of exposure to moisture. It has a total of 252 I/Os and can operate at speeds of 500MHz, 600MHz, and 1.2GHz. Some of its peripherals include DMA and WDT, and it has a combined architecture of MCU and FPGA.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU5EV-1SFVC784E System On Chip (SoC) applications.

AC-input BLDC motor drive
String inverter
PC peripherals
Transmitters
Industrial sectors
Body control module
Optical drive
Multiprocessor system-on-chips (MPSoCs)
Apple smart watch
Published Paper
XCZU5EV-1SFVC784E More Descriptions
FPGA Zynq UltraScale Family 256200 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 256K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
IC SOC CORTEX-A9 667MHZ 676FCBGA
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU5EV-1SFVC784E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Pbfree Code
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    View Compare
  • XCZU5EV-1SFVC784E
    XCZU5EV-1SFVC784E
    11 Weeks
    784-BFBGA, FCBGA
    784-FCBGA (23x23)
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    252
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU9CG-2FFVB1156E
    11 Weeks
    1156-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    328
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    yes
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    -
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    YES
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B625
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
  • XCZU9EG-1FFVC900I
    11 Weeks
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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