Xilinx Inc. XCZU4EV-2FBVB900E

Name: XCZU4EV-2FBVB900E
Brand: Xilinx Inc.
SKU: 3669353-XCZU4EV-2FBVB900E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU4EV-2FBVB900E

Manufacturer:: Xilinx Inc.

Ventron No:: 3669353-XCZU4EV-2FBVB900E

Description:: IC FPGA 204 I/O 900FCBGA

ECAD Model:

Datasheet:: XCZU4EV-2FBVB900E

Specifications

Xilinx Inc. XCZU4EV-2FBVB900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EV-2FBVB900E.

Factory Lead Time
11 Weeks
Package / Case
900-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EV
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
204
Speed
533MHz, 600MHz, 1.3GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 192K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The TJ series Zynq® UltraScale ™ MPSoC EV is an active product with an operating temperature range of 0°C to 100°C. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to moisture for up to 72 hours. The product is classified under HTS Code 8542.31.00.01 and does not have a specified peak reflow temperature. It features a quad-core ARM® Cortex®-A53 MPCore™ processor with CoreSight™ technology, as well as a dual-core ARM® Cortex™-R5 with CoreSight™ and ARM Mali™-400 MP2 processors. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The primary attribute of this product is its Zynq® UltraScale ™ FPGA with over 192K logic cells. It is also compliant with ROHS3 regulations.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU4EV-2FBVB900E System On Chip (SoC) applications.

Servo drive control module
CNC control
Functional safety for critical applications in the aerospace
Sports
Networked sensors
Defense
Level
ARM processors
Robotics
System-on-chip (SoC)

XCZU4EV-2FBVB900E More Descriptions

Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 192K, B900, RoHSXilinx SCT
Zynq UltraScale FPGA Quad APU Video Engine Mid Speed Flip-chip with 1 mm Ball Pitch 192150 Cells 1.5 GHz 900-Ball FCBGA Tray
Mpsoc, Arm Cortex-A53/R5, Fcbga-900; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-2FBVB900E

Product Comparison

The three parts on the right have similar specifications to XCZU4EV-2FBVB900E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU4EV-2FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

yes

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 192K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

yes

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

328

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU4EV-2FBVB900E vs XCZU9CG-2FFVB1156E
XCZU5EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

YES

900

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B900

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU4EV-2FBVB900E vs XCZU5EV-L1FBVB900I
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

308

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU4EV-2FBVB900E vs XCZU19EG-1FFVD1760E