Xilinx Inc. XCZU4EG-2SFVC784I
- Part Number:
- XCZU4EG-2SFVC784I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3163360-XCZU4EG-2SFVC784I
- Description:
- IC FPGA 252 I/O 784FCBGA
- Datasheet:
- XCZU4EG-2SFVC784I
Xilinx Inc. XCZU4EG-2SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EG-2SFVC784I.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O252
- Speed533MHz, 600MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 192K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case of the product is 784-BFBGA, FCBGA, which indicates the type of housing used for the integrated circuit. This package is designed to withstand a wide range of operating temperatures, from -40°C to 100°C TJ. The part status of the product is active, meaning it is currently in production and available for purchase. The moisture sensitivity level (MSL) of the package is 4, which indicates that it can withstand exposure to moisture for up to 72 hours. The HTS code for this product is 8542.31.00.01, which is used for customs purposes to classify the product. The speed of the product can vary, with options of 533MHz, 600MHz, and 1.3GHz. The RAM size of the product is 256KB, indicating the amount of memory available for data storage. The product also includes peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality. The architecture of the product is a combination of MCU (Microcontroller Unit) and FPGA (Field Programmable Gate Array), providing flexibility and versatility in its applications. Lastly, the product is ROHS3 compliant, meaning it meets the requirements of the Restriction of Hazardous Substances directive.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EG-2SFVC784I System On Chip (SoC) applications.
Body control module
Apple smart watch
Transmitters
Deep learning hardware
Test and Measurement
Central alarm system
Automotive gateway
Microprocessors
Smart appliances
Vending machines
The package or case of the product is 784-BFBGA, FCBGA, which indicates the type of housing used for the integrated circuit. This package is designed to withstand a wide range of operating temperatures, from -40°C to 100°C TJ. The part status of the product is active, meaning it is currently in production and available for purchase. The moisture sensitivity level (MSL) of the package is 4, which indicates that it can withstand exposure to moisture for up to 72 hours. The HTS code for this product is 8542.31.00.01, which is used for customs purposes to classify the product. The speed of the product can vary, with options of 533MHz, 600MHz, and 1.3GHz. The RAM size of the product is 256KB, indicating the amount of memory available for data storage. The product also includes peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality. The architecture of the product is a combination of MCU (Microcontroller Unit) and FPGA (Field Programmable Gate Array), providing flexibility and versatility in its applications. Lastly, the product is ROHS3 compliant, meaning it meets the requirements of the Restriction of Hazardous Substances directive.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EG-2SFVC784I System On Chip (SoC) applications.
Body control module
Apple smart watch
Transmitters
Deep learning hardware
Test and Measurement
Central alarm system
Automotive gateway
Microprocessors
Smart appliances
Vending machines
XCZU4EG-2SFVC784I More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 192K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
IC SOC CORTEX-A9 667MHZ 676FCBGA
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 192K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
IC SOC CORTEX-A9 667MHZ 676FCBGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU4EG-2SFVC784I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU4EG-2SFVC784I11 Weeks784-BFBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED252533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 192K Logic CellsROHS3 Compliant------------
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 CompliantYES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
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