Xilinx Inc. XCZU4EG-2FBVB900E
- Part Number:
- XCZU4EG-2FBVB900E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669373-XCZU4EG-2FBVB900E
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU4EG-2FBVB900E
Xilinx Inc. XCZU4EG-2FBVB900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EG-2FBVB900E.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed533MHz, 600MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 192K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The product, published in 2016, has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to 72 hours of moisture. Its HTS Code is 8542.31.00.01, indicating its classification for import and export purposes. The Peak Reflow Temperature is not specified, but the Reflow Temperature-Max is also not specified, indicating that the product can withstand a wide range of temperatures. With a RAM Size of 256KB, the product boasts a powerful Core Processor, specifically a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM®Cortex™-R5 with CoreSight™. In terms of architecture, the product is a versatile MCU and FPGA. Its primary attributes include a Zynq®UltraScale ™ FPGA with 192K Logic Cells, making it a highly advanced and efficient device. Additionally, the product is ROHS3 Compliant, ensuring its compliance with environmental standards.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EG-2FBVB900E System On Chip (SoC) applications.
Functional safety for critical applications in the automotive
String inverter
Industrial sectors
Mobile market
Industrial
Efficient hardware for training of neural networks
Medical Pressure
Flow Sensors
Body control module
Networked sensors
The product, published in 2016, has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to 72 hours of moisture. Its HTS Code is 8542.31.00.01, indicating its classification for import and export purposes. The Peak Reflow Temperature is not specified, but the Reflow Temperature-Max is also not specified, indicating that the product can withstand a wide range of temperatures. With a RAM Size of 256KB, the product boasts a powerful Core Processor, specifically a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM®Cortex™-R5 with CoreSight™. In terms of architecture, the product is a versatile MCU and FPGA. Its primary attributes include a Zynq®UltraScale ™ FPGA with 192K Logic Cells, making it a highly advanced and efficient device. Additionally, the product is ROHS3 Compliant, ensuring its compliance with environmental standards.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EG-2FBVB900E System On Chip (SoC) applications.
Functional safety for critical applications in the automotive
String inverter
Industrial sectors
Mobile market
Industrial
Efficient hardware for training of neural networks
Medical Pressure
Flow Sensors
Body control module
Networked sensors
XCZU4EG-2FBVB900E More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 192K, B900, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 192K, B900, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU4EG-2FBVB900E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPbfree CodePart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusView Compare
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XCZU4EG-2FBVB900E11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGyesActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 192K Logic CellsROHS3 Compliant-
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11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGyesActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED360533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
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11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EV-Active4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EV-Active4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
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