Xilinx Inc. XCZU3EG-2SFVC784I

Name: XCZU3EG-2SFVC784I
Brand: Xilinx Inc.
SKU: 3163341-XCZU3EG-2SFVC784I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU3EG-2SFVC784I

Manufacturer:: Xilinx Inc.

Ventron No:: 3163341-XCZU3EG-2SFVC784I

Description:: IC FPGA 252 I/O 784FCBGA

ECAD Model:

Datasheet:: XCZU3EG-2SFVC784I

Specifications

Xilinx Inc. XCZU3EG-2SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3EG-2SFVC784I.

Factory Lead Time
11 Weeks
Package / Case
784-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
784
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B784
Supply Voltage-Max (Vsup)
0.876V
Supply Voltage-Min (Vsup)
0.825V
Number of I/O
252
Speed
533MHz, 600MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 154K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case for this particular product is 784-BFBGA, FCBGA, and it is packaged in a tray. It was published in 2016 and belongs to the Zynq® UltraScale ™ MPSoC EG series. The part status is active, indicating that it is currently available for purchase. The moisture sensitivity level (MSL) is 4, which means it can withstand exposure to moisture for up to 72 hours. The terminal position is at the bottom, and the terminal form is a ball. It has a total of 252 input/output (I/O) connections. Additionally, it is important to note that this product is ROHS3 compliant, meaning it meets the requirements of the Restriction of Hazardous Substances Directive.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.
XCZU3EG-2SFVC784I System On Chip (SoC) applications.

Remote control
AC drive control module
ARM support modules
Body control module
Networked sensors
Industrial sectors
Multiprocessor system-on-chips (MPSoCs)
Self-aware system-on-chip (SoC)
Industrial AC-DC
Sensor network-on-chip (sNoC)

XCZU3EG-2SFVC784I More Descriptions

FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 154K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA625
Xczu3Eg-2Sfvc784I Rohs Compliant: Yes
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU3EG-2SFVC784I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

Additional Feature

View Compare
XCZU3EG-2SFVC784I

Xilinx Inc.

11 Weeks

784-BFBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

784

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.85V

NOT SPECIFIED

R-PBGA-B784

0.876V

0.825V

252

533MHz, 600MHz, 1.3GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 154K Logic Cells

ROHS3 Compliant

-

-

-
XCZU7CG-2FFVC1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

360

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

yes

-

XCZU3EG-2SFVC784I vs XCZU7CG-2FFVC1156E
XCZU5EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

900

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.72V

NOT SPECIFIED

R-PBGA-B900

0.742V

0.698V

204

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

-

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

XCZU3EG-2SFVC784I vs XCZU5EV-L1FBVB900I
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

464

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

XCZU3EG-2SFVC784I vs XCZU7EV-2FFVF1517I