Xilinx Inc. XCZU3EG-1SFVC784I
- Part Number:
- XCZU3EG-1SFVC784I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669335-XCZU3EG-1SFVC784I
- Description:
- IC FPGA 252 I/O 784FCBGA
- Datasheet:
- XCZU3EG-1SFVC784I
Xilinx Inc. XCZU3EG-1SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3EG-1SFVC784I.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O252
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 154K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case for this product is 784-BFBGA or FCBGA, and the operating temperature range is -40°C to 100°C TJ. The packaging for this product is a tray, and it was published in 2016. This product belongs to the Zynq® UltraScale ™ MPSoC EG series. The reflow temperature maximum is not specified. The speed options for this product are 500MHz, 600MHz, and 1.2GHz. The core processor is a quad ARM® Cortex®-A53 MPCore™ with CoreSight™, as well as a dual ARM® Cortex™-R5 with CoreSight™ and an ARM Mali™-400 MP2. This product has an architecture of MCU and FPGA. It is also ROHS3 compliant, meaning it is environmentally friendly.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3EG-1SFVC784I System On Chip (SoC) applications.
Mobile market
Functional safety for critical applications in the aerospace
Multiprocessor system-on-chips (MPSoCs)
Samsung galaxy gear
Optical drive
Industrial automation devices
POS Terminals
Vending machines
Smart appliances
Mouse
The package or case for this product is 784-BFBGA or FCBGA, and the operating temperature range is -40°C to 100°C TJ. The packaging for this product is a tray, and it was published in 2016. This product belongs to the Zynq® UltraScale ™ MPSoC EG series. The reflow temperature maximum is not specified. The speed options for this product are 500MHz, 600MHz, and 1.2GHz. The core processor is a quad ARM® Cortex®-A53 MPCore™ with CoreSight™, as well as a dual ARM® Cortex™-R5 with CoreSight™ and an ARM Mali™-400 MP2. This product has an architecture of MCU and FPGA. It is also ROHS3 compliant, meaning it is environmentally friendly.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3EG-1SFVC784I System On Chip (SoC) applications.
Mobile market
Functional safety for critical applications in the aerospace
Multiprocessor system-on-chips (MPSoCs)
Samsung galaxy gear
Optical drive
Industrial automation devices
POS Terminals
Vending machines
Smart appliances
Mouse
XCZU3EG-1SFVC784I More Descriptions
FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 0.95V 784-Pin FC-BGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 154K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA625
IC SOC CORTEX-A9 800MHZ 676FCBGA
Xczu3Eg-1Sfvc784I Rohs Compliant: Yes
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 154K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA625
IC SOC CORTEX-A9 800MHZ 676FCBGA
Xczu3Eg-1Sfvc784I Rohs Compliant: Yes
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU3EG-1SFVC784I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU3EG-1SFVC784I11 Weeks784-BFBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED252500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 154K Logic CellsROHS3 Compliant------------
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11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
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11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-----------
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