Xilinx Inc. XCZU3CG-L2SFVA625E
- Part Number:
- XCZU3CG-L2SFVA625E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669286-XCZU3CG-L2SFVA625E
- Description:
- IC FPGA 180 I/O 625FCBGA
- Datasheet:
- XCZU3CG-L2SFVA625E
Xilinx Inc. XCZU3CG-L2SFVA625E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3CG-L2SFVA625E.
- Factory Lead Time11 Weeks
- Package / Case625-BFBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations625
- Additional FeatureALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.72V
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B625
- Supply Voltage-Max (Vsup)0.742V
- Supply Voltage-Min (Vsup)0.698V
- Number of I/O180
- Speed533MHz, 1.3GHz
- RAM Size256KB
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 154K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Xilinx Inc. is a well-known brand in the world of technology, particularly in the field of Embedded - System On Chip (SoC) chips. This specific chip is part of the Embedded - System On Chip (SoC) category, which is designed to provide a complete system on a single chip. One of the key parameters of this chip is its operating temperature, which ranges from 0°C to 100°C TJ. This wide temperature range allows the chip to function in a variety of environments, making it versatile and reliable. The packaging of this chip is in a tray format, ensuring safe and secure transportation and storage. It belongs to the Zynq® UltraScale ™ MPSoC CG series, which is known for its high performance and advanced features. This chip is currently in active production, making it readily available for use in various applications. It has a total of 625 terminations, which refers to the number of connection points on the chip. The terminal position is at the bottom, making it easy to integrate into a circuit board. The reflow temperature, which is the maximum temperature the chip can withstand during the soldering process, is not specified, indicating that it can handle a wide range of temperatures. The chip also comes with various peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), providing additional functionality and flexibility. The primary attribute of this chip is its Zynq®UltraScale ™ FPGA, which stands for Field Programmable Gate Array. This allows users to customize and reprogram the chip according to their specific needs, making it suitable for a wide range of applications. With 154K logic cells, this chip offers a powerful and efficient processing capability. Additionally, it is also compliant with the RoHS3 (Restriction of Hazardous Substances) regulations, ensuring that it is environmentally friendly and safe to use. Overall, the Xilinx Inc. Embedded - System On Chip (SoC) chip offers a combination of advanced features, high performance, and reliability, making it a top choice for various electronic applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU3CG-L2SFVA625E System On Chip (SoC) applications.
RISC-V
Sports
Apple smart watch
Medical
Communication interfaces ( I2C, SPI )
Medical
Networked Media Encode/Decode
High-end PLC
Print Special Issue Flyer
Robotics
Xilinx Inc. is a well-known brand in the world of technology, particularly in the field of Embedded - System On Chip (SoC) chips. This specific chip is part of the Embedded - System On Chip (SoC) category, which is designed to provide a complete system on a single chip. One of the key parameters of this chip is its operating temperature, which ranges from 0°C to 100°C TJ. This wide temperature range allows the chip to function in a variety of environments, making it versatile and reliable. The packaging of this chip is in a tray format, ensuring safe and secure transportation and storage. It belongs to the Zynq® UltraScale ™ MPSoC CG series, which is known for its high performance and advanced features. This chip is currently in active production, making it readily available for use in various applications. It has a total of 625 terminations, which refers to the number of connection points on the chip. The terminal position is at the bottom, making it easy to integrate into a circuit board. The reflow temperature, which is the maximum temperature the chip can withstand during the soldering process, is not specified, indicating that it can handle a wide range of temperatures. The chip also comes with various peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), providing additional functionality and flexibility. The primary attribute of this chip is its Zynq®UltraScale ™ FPGA, which stands for Field Programmable Gate Array. This allows users to customize and reprogram the chip according to their specific needs, making it suitable for a wide range of applications. With 154K logic cells, this chip offers a powerful and efficient processing capability. Additionally, it is also compliant with the RoHS3 (Restriction of Hazardous Substances) regulations, ensuring that it is environmentally friendly and safe to use. Overall, the Xilinx Inc. Embedded - System On Chip (SoC) chip offers a combination of advanced features, high performance, and reliability, making it a top choice for various electronic applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU3CG-L2SFVA625E System On Chip (SoC) applications.
RISC-V
Sports
Apple smart watch
Medical
Communication interfaces ( I2C, SPI )
Medical
Networked Media Encode/Decode
High-end PLC
Print Special Issue Flyer
Robotics
XCZU3CG-L2SFVA625E More Descriptions
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 154K, A625, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
FPGA - Field Programmable Gate Array
Microprocessor Circuit, CMOS, PBGA784
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU3CG-L2SFVA625E.
-
ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeuPs/uCs/Peripheral ICs TypeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusView Compare
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XCZU3CG-L2SFVA625E11 Weeks625-BFBGA, FCBGAYES0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B6250.742V0.698V180533MHz, 1.3GHz256KBMICROPROCESSOR CIRCUITDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 154K Logic CellsROHS3 Compliant-
-
11 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B9000.742V0.698V204500MHz, 600MHz, 1.2GHz256KBMICROPROCESSOR CIRCUITQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant
-
11 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)--8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED---204500MHz, 600MHz, 1.2GHz256KB-Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant
-
11 Weeks1760-BBGA, FCBGA-0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)--8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED---308500MHz, 600MHz, 1.2GHz256KB-Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant
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