XCZU3CG-L2SFVA625E

Xilinx Inc. XCZU3CG-L2SFVA625E

Part Number:
XCZU3CG-L2SFVA625E
Manufacturer:
Xilinx Inc.
Ventron No:
3669286-XCZU3CG-L2SFVA625E
Description:
IC FPGA 180 I/O 625FCBGA
ECAD Model:
Datasheet:
XCZU3CG-L2SFVA625E

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Specifications
Xilinx Inc. XCZU3CG-L2SFVA625E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3CG-L2SFVA625E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    625-BFBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    625
  • Additional Feature
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.72V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B625
  • Supply Voltage-Max (Vsup)
    0.742V
  • Supply Voltage-Min (Vsup)
    0.698V
  • Number of I/O
    180
  • Speed
    533MHz, 1.3GHz
  • RAM Size
    256KB
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 154K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Xilinx Inc. is a well-known brand in the world of technology, particularly in the field of Embedded - System On Chip (SoC) chips. This specific chip is part of the Embedded - System On Chip (SoC) category, which is designed to provide a complete system on a single chip. One of the key parameters of this chip is its operating temperature, which ranges from 0°C to 100°C TJ. This wide temperature range allows the chip to function in a variety of environments, making it versatile and reliable. The packaging of this chip is in a tray format, ensuring safe and secure transportation and storage. It belongs to the Zynq® UltraScale ™ MPSoC CG series, which is known for its high performance and advanced features. This chip is currently in active production, making it readily available for use in various applications. It has a total of 625 terminations, which refers to the number of connection points on the chip. The terminal position is at the bottom, making it easy to integrate into a circuit board. The reflow temperature, which is the maximum temperature the chip can withstand during the soldering process, is not specified, indicating that it can handle a wide range of temperatures. The chip also comes with various peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), providing additional functionality and flexibility. The primary attribute of this chip is its Zynq®UltraScale ™ FPGA, which stands for Field Programmable Gate Array. This allows users to customize and reprogram the chip according to their specific needs, making it suitable for a wide range of applications. With 154K logic cells, this chip offers a powerful and efficient processing capability. Additionally, it is also compliant with the RoHS3 (Restriction of Hazardous Substances) regulations, ensuring that it is environmentally friendly and safe to use. Overall, the Xilinx Inc. Embedded - System On Chip (SoC) chip offers a combination of advanced features, high performance, and reliability, making it a top choice for various electronic applications.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU3CG-L2SFVA625E System On Chip (SoC) applications.

RISC-V
Sports
Apple smart watch
Medical
Communication interfaces ( I2C, SPI )
Medical
Networked Media Encode/Decode
High-end PLC
Print Special Issue Flyer
Robotics
XCZU3CG-L2SFVA625E More Descriptions
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 154K, A625, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU3CG-L2SFVA625E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    View Compare
  • XCZU3CG-L2SFVA625E
    XCZU3CG-L2SFVA625E
    11 Weeks
    625-BFBGA, FCBGA
    YES
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B625
    0.742V
    0.698V
    180
    533MHz, 1.3GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 154K Logic Cells
    ROHS3 Compliant
    -
  • XCZU5EV-L1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    900
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B900
    0.742V
    0.698V
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
  • XCZU9EG-1FFVC900I
    11 Weeks
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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