Xilinx Inc. XCZU2EG-L2SBVA484E
- Part Number:
- XCZU2EG-L2SBVA484E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669316-XCZU2EG-L2SBVA484E
- Description:
- IC FPGA 82 I/O 484FCBGA
- Datasheet:
- XCZU2EG-L2SBVA484E
Xilinx Inc. XCZU2EG-L2SBVA484E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2EG-L2SBVA484E.
- Factory Lead Time11 Weeks
- Package / Case484-BFBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2013
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations484
- Additional FeatureALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.72V
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B484
- Supply Voltage-Max (Vsup)0.742V
- Supply Voltage-Min (Vsup)0.698V
- Number of I/O82
- Speed533MHz, 600MHz, 1.3GHz
- RAM Size256KB
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 103K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - System On Chip (SoC) chips. These chips are highly advanced and offer a wide range of capabilities, making them a popular choice among developers and engineers. The specific chip in question belongs to the Embedded - System On Chip (SoC) category, which is known for its high-performance and versatile nature. It is designed and manufactured by Xilinx Inc., a company known for its cutting-edge technology and innovative solutions. One of the key features of this chip is its packaging, which is done in trays for easy handling and storage. This makes it convenient for manufacturers to integrate the chip into their products. Additionally, the chip is part of the Zynq® UltraScale ™ MPSoC EG series, which is known for its exceptional performance and reliability. It is also equipped with an additional feature that allows it to operate with a 0.85V nominal supply, providing even more flexibility for its use in various applications. In terms of its technical specifications, the chip has a bottom terminal position and is classified under the JESD-30 Code R-PBGA-B484. This ensures its compatibility with a wide range of devices and systems. The chip has a maximum supply voltage (Vsup) of 0.742V and a minimum supply voltage (Vsup) of 0.698V, making it energy-efficient and suitable for use in low-power devices. It also has a high number of I/O (input/output) ports, with 82 in total, allowing for seamless connectivity and data transfer. One of the standout features of this chip is its impressive RAM size of 256KB, which is crucial for handling complex tasks and storing large amounts of data. This, combined with its primary attributes as a Zynq®UltraScale ™ FPGA (Field-Programmable Gate Array), with over 103K logic cells, makes it a powerful and versatile chip that can handle a wide range of applications. Whether it is used in industrial machinery, communication systems, or consumer electronics, this chip offers top-of-the-line performance and reliability. In conclusion, the Xilinx Inc. chip in question is a highly advanced and versatile Embedded - System On Chip (SoC) that offers exceptional performance and reliability. Its packaging, series, additional feature, terminal position, JESD-30 Code, supply voltage, I/O ports, RAM size, and primary attributes all contribute to its impressive capabilities and make it a top choice for developers and engineers in various industries. With Xilinx Inc.'s reputation for innovation and cutting-edge technology, this chip is sure to meet the demands of any complex and demanding application.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU2EG-L2SBVA484E System On Chip (SoC) applications.
CNC control
Cyberphysical system-on-chip
POS Terminals
Keyboard
Central alarm system
AC-input BLDC motor drive
Automated sorting equipment
Video Imaging
Transmitters
Embedded systems
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - System On Chip (SoC) chips. These chips are highly advanced and offer a wide range of capabilities, making them a popular choice among developers and engineers. The specific chip in question belongs to the Embedded - System On Chip (SoC) category, which is known for its high-performance and versatile nature. It is designed and manufactured by Xilinx Inc., a company known for its cutting-edge technology and innovative solutions. One of the key features of this chip is its packaging, which is done in trays for easy handling and storage. This makes it convenient for manufacturers to integrate the chip into their products. Additionally, the chip is part of the Zynq® UltraScale ™ MPSoC EG series, which is known for its exceptional performance and reliability. It is also equipped with an additional feature that allows it to operate with a 0.85V nominal supply, providing even more flexibility for its use in various applications. In terms of its technical specifications, the chip has a bottom terminal position and is classified under the JESD-30 Code R-PBGA-B484. This ensures its compatibility with a wide range of devices and systems. The chip has a maximum supply voltage (Vsup) of 0.742V and a minimum supply voltage (Vsup) of 0.698V, making it energy-efficient and suitable for use in low-power devices. It also has a high number of I/O (input/output) ports, with 82 in total, allowing for seamless connectivity and data transfer. One of the standout features of this chip is its impressive RAM size of 256KB, which is crucial for handling complex tasks and storing large amounts of data. This, combined with its primary attributes as a Zynq®UltraScale ™ FPGA (Field-Programmable Gate Array), with over 103K logic cells, makes it a powerful and versatile chip that can handle a wide range of applications. Whether it is used in industrial machinery, communication systems, or consumer electronics, this chip offers top-of-the-line performance and reliability. In conclusion, the Xilinx Inc. chip in question is a highly advanced and versatile Embedded - System On Chip (SoC) that offers exceptional performance and reliability. Its packaging, series, additional feature, terminal position, JESD-30 Code, supply voltage, I/O ports, RAM size, and primary attributes all contribute to its impressive capabilities and make it a top choice for developers and engineers in various industries. With Xilinx Inc.'s reputation for innovation and cutting-edge technology, this chip is sure to meet the demands of any complex and demanding application.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU2EG-L2SBVA484E System On Chip (SoC) applications.
CNC control
Cyberphysical system-on-chip
POS Terminals
Keyboard
Central alarm system
AC-input BLDC motor drive
Automated sorting equipment
Video Imaging
Transmitters
Embedded systems
XCZU2EG-L2SBVA484E More Descriptions
FPGA Zynq UltraScale Family 103320 Cells 20nm Technology 0.85V 484-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 103K, A484, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 103K, A484, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU2EG-L2SBVA484E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeuPs/uCs/Peripheral ICs TypeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeView Compare
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XCZU2EG-L2SBVA484E11 Weeks484-BFBGA, FCBGAYES0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)484ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B4840.742V0.698V82533MHz, 600MHz, 1.3GHz256KBMICROPROCESSOR CIRCUITQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 Compliant--
-
11 Weeks1156-BBGA, FCBGA-0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)--8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED---328533MHz, 1.3GHz256KB-Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes
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11 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B9000.742V0.698V204500MHz, 600MHz, 1.2GHz256KBMICROPROCESSOR CIRCUITQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-
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11 Weeks625-BFBGA, FCBGAYES-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B6250.742V0.698V180500MHz, 600MHz, 1.2GHz256KBMICROPROCESSOR CIRCUITQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 Compliant-
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