XCZU2EG-L2SBVA484E

Xilinx Inc. XCZU2EG-L2SBVA484E

Part Number:
XCZU2EG-L2SBVA484E
Manufacturer:
Xilinx Inc.
Ventron No:
3669316-XCZU2EG-L2SBVA484E
Description:
IC FPGA 82 I/O 484FCBGA
ECAD Model:
Datasheet:
XCZU2EG-L2SBVA484E

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Specifications
Xilinx Inc. XCZU2EG-L2SBVA484E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2EG-L2SBVA484E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    484-BFBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2013
  • Series
    Zynq® UltraScale ™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    484
  • Additional Feature
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.72V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B484
  • Supply Voltage-Max (Vsup)
    0.742V
  • Supply Voltage-Min (Vsup)
    0.698V
  • Number of I/O
    82
  • Speed
    533MHz, 600MHz, 1.3GHz
  • RAM Size
    256KB
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - System On Chip (SoC) chips. These chips are highly advanced and offer a wide range of capabilities, making them a popular choice among developers and engineers. The specific chip in question belongs to the Embedded - System On Chip (SoC) category, which is known for its high-performance and versatile nature. It is designed and manufactured by Xilinx Inc., a company known for its cutting-edge technology and innovative solutions. One of the key features of this chip is its packaging, which is done in trays for easy handling and storage. This makes it convenient for manufacturers to integrate the chip into their products. Additionally, the chip is part of the Zynq® UltraScale ™ MPSoC EG series, which is known for its exceptional performance and reliability. It is also equipped with an additional feature that allows it to operate with a 0.85V nominal supply, providing even more flexibility for its use in various applications. In terms of its technical specifications, the chip has a bottom terminal position and is classified under the JESD-30 Code R-PBGA-B484. This ensures its compatibility with a wide range of devices and systems. The chip has a maximum supply voltage (Vsup) of 0.742V and a minimum supply voltage (Vsup) of 0.698V, making it energy-efficient and suitable for use in low-power devices. It also has a high number of I/O (input/output) ports, with 82 in total, allowing for seamless connectivity and data transfer. One of the standout features of this chip is its impressive RAM size of 256KB, which is crucial for handling complex tasks and storing large amounts of data. This, combined with its primary attributes as a Zynq®UltraScale ™ FPGA (Field-Programmable Gate Array), with over 103K logic cells, makes it a powerful and versatile chip that can handle a wide range of applications. Whether it is used in industrial machinery, communication systems, or consumer electronics, this chip offers top-of-the-line performance and reliability. In conclusion, the Xilinx Inc. chip in question is a highly advanced and versatile Embedded - System On Chip (SoC) that offers exceptional performance and reliability. Its packaging, series, additional feature, terminal position, JESD-30 Code, supply voltage, I/O ports, RAM size, and primary attributes all contribute to its impressive capabilities and make it a top choice for developers and engineers in various industries. With Xilinx Inc.'s reputation for innovation and cutting-edge technology, this chip is sure to meet the demands of any complex and demanding application.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU2EG-L2SBVA484E System On Chip (SoC) applications.

CNC control
Cyberphysical system-on-chip
POS Terminals
Keyboard
Central alarm system
AC-input BLDC motor drive
Automated sorting equipment
Video Imaging
Transmitters
Embedded systems
XCZU2EG-L2SBVA484E More Descriptions
FPGA Zynq UltraScale Family 103320 Cells 20nm Technology 0.85V 484-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 103K, A484, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU2EG-L2SBVA484E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Pbfree Code
    View Compare
  • XCZU2EG-L2SBVA484E
    XCZU2EG-L2SBVA484E
    11 Weeks
    484-BFBGA, FCBGA
    YES
    0°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    484
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B484
    0.742V
    0.698V
    82
    533MHz, 600MHz, 1.3GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    -
    -
  • XCZU9CG-2FFVB1156E
    11 Weeks
    1156-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    328
    533MHz, 1.3GHz
    256KB
    -
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    yes
  • XCZU5EV-L1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    900
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B900
    0.742V
    0.698V
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    -
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B625
    0.742V
    0.698V
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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