Xilinx Inc. XCZU2EG-2SFVC784E

Name: XCZU2EG-2SFVC784E
Brand: Xilinx Inc.
SKU: 3669278-XCZU2EG-2SFVC784E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU2EG-2SFVC784E

Manufacturer:: Xilinx Inc.

Ventron No:: 3669278-XCZU2EG-2SFVC784E

Description:: IC FPGA 252 I/O 784FCBGA

ECAD Model:

Datasheet:: XCZU2EG-2SFVC784E

Specifications

Xilinx Inc. XCZU2EG-2SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2EG-2SFVC784E.

Factory Lead Time
11 Weeks
Package / Case
784-BFBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2013
Series
Zynq® UltraScale ™ MPSoC EG
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
252
Speed
533MHz, 600MHz, 1.3GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 103K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Xilinx Inc. is the brand of this part, which is an Embedded - System On Chip (SoC) chip. It falls under the Embedded - System On Chip (SoC) category and was published in 2013. The package/case for this chip is 784-BFBGA or FCBGA, and it is Pbfree with a Pbfree Code of yes. The part status is currently Active and its Moisture Sensitivity Level (MSL) is 4 (72 Hours). The HTS Code for this chip is 8542.31.00.01 and its Peak Reflow Temperature is NOT SPECIFIED. The Reflow Temperature-Max is also NOT SPECIFIED. This chip has 252 I/Os and its primary attributes include being a Zynq®UltraScale ™ FPGA with 103K Logic Cells.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU2EG-2SFVC784E System On Chip (SoC) applications.

Microcontroller
DC-input BLDC motor drive
Flow Sensors
Vending machines
Video Imaging
Embedded systems
Efficient hardware for training of neural networks
Optical drive
Industrial automation devices
ARM Cortex M4 microcontroller

XCZU2EG-2SFVC784E More Descriptions

FPGA Zynq UltraScale Family 103320 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 103K, C784, RoHSXilinx SCT
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU2EG-2SFVC784E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU2EG-2SFVC784E

Xilinx Inc.

11 Weeks

784-BFBGA, FCBGA

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

yes

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

252

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-
XCZU7CG-2FFVC1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

yes

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

360

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU2EG-2SFVC784E vs XCZU7CG-2FFVC1156E
XCZU5EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

YES

900

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B900

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU2EG-2SFVC784E vs XCZU5EV-L1FBVB900I
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU2EG-2SFVC784E vs XCZU7EV-1FBVB900E