Xilinx Inc. XCZU2CG-2SFVA625I

Name: XCZU2CG-2SFVA625I
Brand: Xilinx Inc.
SKU: 3669292-XCZU2CG-2SFVA625I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU2CG-2SFVA625I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669292-XCZU2CG-2SFVA625I

Description:: IC FPGA 180 I/O 625FCBGA

ECAD Model:

Datasheet:: XCZU2CG-2SFVA625I

Specifications

Xilinx Inc. XCZU2CG-2SFVA625I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2CG-2SFVA625I.

Factory Lead Time
11 Weeks
Package / Case
625-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
625
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B625
Supply Voltage-Max (Vsup)
0.876V
Supply Voltage-Min (Vsup)
0.825V
Number of I/O
180
Speed
533MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 103K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Embedded - System On Chip (SoC) chip from Xilinx Inc. is a powerful and versatile component that falls under the Embedded - System On Chip (SoC) category. It features a 625-BFBGA, FCBGA package and is packaged in a tray with a Moisture Sensitivity Level (MSL) of 4 (72 Hours). With 625 terminations and a Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) terminal finish, this chip is designed for optimal performance. Its Terminal Position is located at the BOTTOM and it operates at a maximum supply voltage of 0.876V. This MICROPROCESSOR CIRCUIT is an MCU and FPGA architecture, making it suitable for a variety of applications.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.
XCZU2CG-2SFVA625I System On Chip (SoC) applications.

Smartphones
Functional safety for critical applications in the industrial sectors
Measurement testers
Flow Sensors
Industrial Pressure
Multiprocessor system-on-chips (MPSoCs)
Cyberphysical system-on-chip
High-end PLC
Measurement tools
Fitness

XCZU2CG-2SFVA625I More Descriptions

FPGA Zynq UltraScale Family 103320 Cells 20nm Technology 0.85V 625-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 103K, A625, RoHSXilinx SCT
IC SOC CORTEX-M3 166MHZ 484FBGA
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU2CG-2SFVA625I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

Additional Feature

View Compare
XCZU2CG-2SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

e1

Active

4 (72 Hours)

625

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.85V

NOT SPECIFIED

R-PBGA-B625

0.876V

0.825V

180

533MHz, 1.3GHz

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

-

-

-
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

-

Active

4 (72 Hours)

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

328

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

yes

-

XCZU2CG-2SFVA625I vs XCZU9CG-2FFVB1156E
XCZU5EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

-

Active

4 (72 Hours)

900

-

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.72V

NOT SPECIFIED

R-PBGA-B900

0.742V

0.698V

204

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

-

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

XCZU2CG-2SFVA625I vs XCZU5EV-L1FBVB900I
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

-

Active

4 (72 Hours)

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

-

XCZU2CG-2SFVA625I vs XCZU9EG-1FFVC900I