Xilinx Inc. XCZU19EG-1FFVC1760I

Name: XCZU19EG-1FFVC1760I
Brand: Xilinx Inc.
SKU: 3669029-XCZU19EG-1FFVC1760I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU19EG-1FFVC1760I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669029-XCZU19EG-1FFVC1760I

Description:: IC FPGA 512 I/O 1760FCBGA

ECAD Model:

Datasheet:: XCZU19EG-1FFVC1760I

Specifications

Xilinx Inc. XCZU19EG-1FFVC1760I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU19EG-1FFVC1760I.

Factory Lead Time
11 Weeks
Package / Case
1760-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
512
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 1143K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case for this product is 1760-BBGA or FCBGA. It has an operating temperature range of -40°C to 100°C TJ and comes in a tray packaging. The moisture sensitivity level is 4, meaning it can withstand exposure to moisture for up to 72 hours. The reflow temperature is not specified. This product has 512 I/Os and a speed of 500MHz, 600MHz, or 1.2GHz. It features a quad-core ARM® Cortex®-A53 MPCore™ processor with CoreSight™, as well as dual-core ARM® Cortex™-R5 with CoreSight™ and ARM Mali™-400 MP2. It is designed with an MCU and FPGA architecture and its primary attributes include Zynq®UltraScale ™ FPGA and 1143K logic cells.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU19EG-1FFVC1760I System On Chip (SoC) applications.

Test and Measurement
Functional safety for critical applications in the aerospace
Wireless networking
Published Paper
Flow Sensors
Communication network-on-Chip (cNoC)
Microprocessors
PC peripherals
Efficient hardware for training of neural networks
Digital Media

XCZU19EG-1FFVC1760I More Descriptions

Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 1143K, C1760, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1517
FPGA - Field Programmable Gate Array
FIXED IND 2.7NH 450MA 250 MOHM
Xilinx Commercial Zynq UltraScale 1143450 System Logic Cells 1045440 CLB Flip-Flops Quad APU/Dual RPU/Single GPU Flip-chip with 1.0mm Ball Pitch Industrial Temperature 1760-Pin FCBGA Bulk

Product Comparison

The three parts on the right have similar specifications to XCZU19EG-1FFVC1760I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU19EG-1FFVC1760I

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

512

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

180

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

YES

625

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B625

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVC1760I vs XCZU2EG-L1SFVA625I
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU19EG-1FFVC1760I vs XCZU9EG-1FFVC900I
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

464

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU19EG-1FFVC1760I vs XCZU7EV-2FFVF1517I