Xilinx Inc. XCZU17EG-L2FFVD1760E

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The 1760-BBGA and FCBGA package/case is a popular choice for electronic components, thanks to its surface mount capability. This particular package is designed for the Zynq® UltraScale ™ MPSoC EG series, which is currently active and widely used in various industries. The HTS code for this package is 8542.31.00.01, indicating its classification for import and export purposes. The terminal form for this package is BALL, providing a reliable and efficient connection. The supply voltage for this package is 0.72V, making it suitable for a wide range of applications. It also has a JESD-30 code of R-PBGA-B1760, indicating its compliance with industry standards. With a speed of 533MHz, 600MHz, and 1.3GHz, this package is capable of handling high-speed operations. In terms of connectivity, it offers a variety of options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it a versatile choice for different electronic devices.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU17EG-L2FFVD1760E System On Chip (SoC) applications.

Industrial AC-DC
ARM Cortex M4 microcontroller
Self-aware system-on-chip (SoC)
Vending machines
Networked Media Encode/Decode
Flow Sensors
Wireless sensor networks
AC-input BLDC motor drive
USB hard disk enclosure
Networked sensors