Xilinx Inc. XCZU17EG-1FFVB1517I

Name: XCZU17EG-1FFVB1517I
Brand: Xilinx Inc.
SKU: 3669074-XCZU17EG-1FFVB1517I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU17EG-1FFVB1517I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669074-XCZU17EG-1FFVB1517I

Description:: IC FPGA 644 I/O 1517FCBGA

ECAD Model:

Datasheet:: XCZU17EG-1FFVB1517I

Specifications

Xilinx Inc. XCZU17EG-1FFVB1517I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU17EG-1FFVB1517I.

Factory Lead Time
11 Weeks
Package / Case
1517-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
644
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 926K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
This particular component is manufactured by Xilinx Inc. and falls under the category of Embedded - System On Chip (SoC) chips. Its operating temperature range is -40°C to 100°C TJ and it is packaged in a tray. This specific model belongs to the Zynq® UltraScale ™ MPSoC EG series and has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to moisture for up to 72 hours. Its HTS Code is 8542.31.00.01. The reflow temperature maximum is not specified. The chip has a speed of 500MHz, 600MHz, or 1.2GHz and its core processor is composed of a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, and Dual ARM® Cortex™-R5 with CoreSight™, as well as an ARM Mali™-400 MP2. It also has peripherals such as DMA and WDT. The primary attributes of this chip include its Zynq® UltraScale ™ FPGA and its impressive 926K logic cells.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU17EG-1FFVB1517I System On Chip (SoC) applications.

Level
Medical
Networked sensors
Communication interfaces ( I2C, SPI )
Medical Pressure
Robotics
Body control module
Automotive
Remote control
Special Issue Editors

XCZU17EG-1FFVB1517I More Descriptions

Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 926K, B1517, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Xilinx Commercial Zynq UltraScale 926194 System Logic Cells 846806 CLB Flip-Flops Quad APU/Dual RPU/Single GPU Flip-chip with 1.0mm Ball Pitch Industrial Temperature 1517-Pin FCBGA Bulk

Product Comparison

The three parts on the right have similar specifications to XCZU17EG-1FFVB1517I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

View Compare
XCZU17EG-1FFVB1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

644

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 926K Logic Cells

ROHS3 Compliant

-

-
XCZU7CG-2FFVC1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

360

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

yes

XCZU17EG-1FFVB1517I vs XCZU7CG-2FFVC1156E
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

328

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

yes

XCZU17EG-1FFVB1517I vs XCZU9CG-2FFVB1156E
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

XCZU17EG-1FFVB1517I vs XCZU9EG-1FFVC900I