Xilinx Inc. XCZU11EG-1FFVF1517I

Name: XCZU11EG-1FFVF1517I
Brand: Xilinx Inc.
SKU: 3828076-XCZU11EG-1FFVF1517I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU11EG-1FFVF1517I

Manufacturer:: Xilinx Inc.

Ventron No:: 3828076-XCZU11EG-1FFVF1517I

Description:: IC FPGA 464 I/O 1517FCBGA

ECAD Model:

Datasheet:: XCZU11EG-1FFVF1517I

Specifications

Xilinx Inc. XCZU11EG-1FFVF1517I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU11EG-1FFVF1517I.

Factory Lead Time
11 Weeks
Package / Case
1517-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
464
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 653K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The specific part being referred to is manufactured by Xilinx Inc. and falls under the category of Embedded - System On Chip (SoC) chips. It is a part of the Zynq® UltraScale ™ MPSoC EG series, which was published in 2016. The packaging for this part is Tray and it has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to moisture for up to 72 hours. The HTS Code for this part is 8542.31.00.01 and its Peak Reflow Temperature is not specified. It has a total of 464 input/output connections and a RAM size of 256KB. The core processor for this part is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, as well as a Dual ARM® Cortex™-R5 with CoreSight™ and an ARM Mali™-400 MP2. This part falls under the architecture category of MCU (Microcontroller Unit) and FPGA (Field-Programmable Gate Array).

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU11EG-1FFVF1517I System On Chip (SoC) applications.

Mobile market
Keyboard
RISC-V
Measurement testers
Smart appliances
Central alarm system
Industrial automation devices
Print Special Issue Flyer
Microprocessors
Special Issue Information

XCZU11EG-1FFVF1517I More Descriptions

FPGA Zynq UltraScale Family 653100 Cells 20nm Technology 0.85V 1517-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 653K, F1517, RoHSXilinx SCT
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU11EG-1FFVF1517I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU11EG-1FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

464

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 653K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-
XCZU5EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

YES

900

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B900

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVF1517I vs XCZU5EV-L1FBVB900I
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU11EG-1FFVF1517I vs XCZU7EV-1FBVB900E
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU11EG-1FFVF1517I vs XCZU9EG-1FFVC900I