Microsemi Corporation M2S060-FGG676I
- Part Number:
- M2S060-FGG676I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669319-M2S060-FGG676I
- Description:
- IC FPGA SOC 60K LUTS
- Datasheet:
- M2S060-FGG676I
Microsemi Corporation M2S060-FGG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S060-FGG676I.
- Factory Lead Time3 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 2 weeks ago)
- Package / Case676-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- Number of Outputs387
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O387
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs387
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 60K Logic Modules
- Number of Logic Cells56520
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length27mm
- Width27mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.This system on a chip is packaged as 676-BGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.Internally, this SoC design uses the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.The average operating temps for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 387 I/Os in total.A 1.2V power supply is recommended.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.There is a possibility that it can be powered by a power supply of at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.Having 676 terminations in total makes system on a chip possible.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 387 outputs, which is convenient.There is 1.2V power supply required for system on chip.A SoC chip with 387 inputs is available to the user.The logic SoC features 56520 logic cells.A flashing 256KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060-FGG676I System On Chip (SoC) applications.
Video Imaging
Functional safety for critical applications in the automotive
Functional safety for critical applications in the industrial sectors
Smart appliances
Keyboard
Cyberphysical system-on-chip
External USB hard disk/SSD
POS Terminals
ARM Cortex M4 microcontroller
Digital Signal Processing
A core processor ARM? Cortex?-M3 is used to build this SoC.This system on a chip is packaged as 676-BGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.Internally, this SoC design uses the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.The average operating temps for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 387 I/Os in total.A 1.2V power supply is recommended.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.There is a possibility that it can be powered by a power supply of at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.Having 676 terminations in total makes system on a chip possible.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 387 outputs, which is convenient.There is 1.2V power supply required for system on chip.A SoC chip with 387 inputs is available to the user.The logic SoC features 56520 logic cells.A flashing 256KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060-FGG676I System On Chip (SoC) applications.
Video Imaging
Functional safety for critical applications in the automotive
Functional safety for critical applications in the industrial sectors
Smart appliances
Keyboard
Cyberphysical system-on-chip
External USB hard disk/SSD
POS Terminals
ARM Cortex M4 microcontroller
Digital Signal Processing
M2S060-FGG676I More Descriptions
FPGA SmartFusion2 Family 12084 Cells 166MHz 65nm Technology1.2V 144-Pin TQFP
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
M2S060-Fgg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S060-FGG676I
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA676
IC SOC CORTEX-M3 166MHZ 676FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
M2S060-Fgg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S060-FGG676I
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA676
IC SOC CORTEX-M3 166MHZ 676FBGA
The three parts on the right have similar specifications to M2S060-FGG676I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPbfree CodeReach Compliance CodeView Compare
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M2S060-FGG676I3 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)676-BGAYES-40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)676MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B676387Not Qualified1.26V1.2V1.14V387166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA387FIELD PROGRAMMABLE GATE ARRAYFPGA - 60K Logic Modules56520256KB2.44mm27mm27mmRoHS Compliant---
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-OBSOLETE (Last Updated: 3 weeks ago)144-LQFPYES-40°C~100°C TJTray2015SmartFusion®2e0Obsolete3 (168 Hours)144Tin/Lead (Sn/Pb)8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G144--1.26V-1.14V84166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FIELD PROGRAMMABLE GATE ARRAYFPGA - 5K Logic Modules-128KB1.6mm20mm20mmNon-RoHS Compliantnonot_compliant
-
8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFPYES-40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G144--1.26V-1.14V84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliantyes-
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8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTray-SmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant--
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