M2S050TS-FGG484I

Microsemi Corporation M2S050TS-FGG484I

Part Number:
M2S050TS-FGG484I
Manufacturer:
Microsemi Corporation
Ventron No:
4544176-M2S050TS-FGG484I
Description:
IC FPGA SOC 50K LUTS
ECAD Model:
Datasheet:
M2S050TS-FGG484I

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Microsemi Corporation M2S050TS-FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050TS-FGG484I.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 2 weeks ago)
  • Package / Case
    484-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B484
  • Number of Outputs
    267
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    267
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    267
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 50K Logic Modules
  • Number of Logic Cells
    56340
  • Flash Size
    256KB
  • Height Seated (Max)
    2.44mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.Its package is 484-BGA.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.A state-of-the-art Tray package houses this SoC system on a chip.267 I/Os in total are included in this SoC part.A power supply with a 1.2V rating is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.In order to run it, it must be fed by at least 1.14V of power.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.Having 484 terminations in total makes system on a chip possible.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 267 outputs.As far as power supplies are concerned, system on chip requires 1.2V.This SoC chip has a total of 267 inputs that can be used.System on chips of logic are comprised of 56340 logic cells.There is a flash of 256KB.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S050TS-FGG484I System On Chip (SoC) applications.

Robotics
Industrial automation devices
Deep learning hardware
Industrial transport
Flow Sensors
Functional safety for critical applications in the automotive
Microcontroller
Medical Pressure
Test and Measurement
Industrial automation devices
Product Comparison
The three parts on the right have similar specifications to M2S050TS-FGG484I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Pbfree Code
    Reach Compliance Code
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S050TS-FGG484I
    M2S050TS-FGG484I
    10 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    484-BGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    484
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B484
    267
    Not Qualified
    1.26V
    1.2V
    1.14V
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    267
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    23mm
    23mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S005-1TQ144I
    -
    OBSOLETE (Last Updated: 3 weeks ago)
    144-LQFP
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Obsolete
    3 (168 Hours)
    144
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    NOT SPECIFIED
    S-PQFP-G144
    -
    -
    1.26V
    -
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 5K Logic Modules
    -
    128KB
    1.6mm
    20mm
    20mm
    Non-RoHS Compliant
    no
    not_compliant
    -
    -
    -
    -
    -
    -
    -
  • M2S050T-FGG896I
    8 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    896-BGA
    YES
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    896
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    377
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S025T-1FGG484I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    RoHS Compliant
    -
    -
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S025T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 19 March 2024

    AT24C02 Pinout, Working Principle, Characteristics and More

    Ⅰ. AT24C02 overviewⅡ. Working principle of AT24C02Ⅲ. Pins and functions of AT24C02Ⅳ. Characteristics of AT24C02Ⅴ. Block diagram of AT24C02Ⅵ. What should we pay attention to when using AT24C02?Ⅶ....
  • 20 March 2024

    L9110S Advantages, Pinout, Working Principle and Application

    Ⅰ. L9110S overviewⅡ. Advantages of L9110SⅢ. L9110S pin configurationⅣ. Hardware introduction of L9110S motor drive moduleⅤ. Working principle of L9110S motor drive moduleⅥ. L9110S application circuitⅦ. How to...
  • 20 March 2024

    PCF8563 Alternatives, Characteristics, Functions and More

    Ⅰ. Introduction to PCF8563Ⅱ. Characteristics of PCF8563Ⅲ. Main functions of PCF8563Ⅳ. Block diagram of PCF8563Ⅴ. How does PCF8563 work?Ⅵ. Application circuit of PCF8563Ⅶ. Limiting values of PCF8563Ⅷ. How...
  • 21 March 2024

    RC0402FR-075K1L Characteristics, Specifications, Construction and Other Details

    Ⅰ. Overview of RC0402FR-075K1LⅡ. Characteristics of RC0402FR-075K1LⅢ. Specifications of RC0402FR-075K1LⅣ. Construction of RC0402FR-075K1LⅤ. Application of RC0402FR-075K1LⅥ. Inventory history of RC0402FR-075K1LⅦ. Manufacturer of RC0402FR-075K1LⅧ. How to use RC0402FR-075K1L resistor...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.