Microsemi Corporation M2S050T-FGG484
- Part Number:
- M2S050T-FGG484
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828098-M2S050T-FGG484
- Description:
- IC FPGA SOC 50K LUTS 484FBGA
- Datasheet:
- SmartFusion2 Pin Descriptions
Microsemi Corporation M2S050T-FGG484 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050T-FGG484.
- Factory Lead Time7 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case484-BGA
- Number of Pins484
- Supplier Device Package484-FPBGA (23x23)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Frequency166MHz
- Base Part NumberM2S050T
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O267
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesFPGA - 50K Logic Modules
- Flash Size256KB
- RoHS StatusRoHS Compliant
- Lead FreeContains Lead
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.In addition, this SoC security combines FPGA - 50K Logic Modules.Tray package houses this SoC system on a chip.This SoC part contains a total of 267 I/Os in total.The flash is set to 256KB.Searching M2S050T will yield system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.The SoC meaning is based on the core architecture of ARM.The computer SoC has a pin count of 484.For the SoC computing to start, 0°C is sufficient.There is an operating temperature limit of 85°C which is the maximum operating temperature designed for this SoC system on chip.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S050T-FGG484 System On Chip (SoC) applications.
Central inverter
POS Terminals
Fitness
Smart appliances
Measurement tools
Automotive
sequence controllers
PC peripherals
Temperature
Video Imaging
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.In addition, this SoC security combines FPGA - 50K Logic Modules.Tray package houses this SoC system on a chip.This SoC part contains a total of 267 I/Os in total.The flash is set to 256KB.Searching M2S050T will yield system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.The SoC meaning is based on the core architecture of ARM.The computer SoC has a pin count of 484.For the SoC computing to start, 0°C is sufficient.There is an operating temperature limit of 85°C which is the maximum operating temperature designed for this SoC system on chip.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S050T-FGG484 System On Chip (SoC) applications.
Central inverter
POS Terminals
Fitness
Smart appliances
Measurement tools
Automotive
sequence controllers
PC peripherals
Temperature
Video Imaging
M2S050T-FGG484 More Descriptions
FPGA SmartFusion2 56340 Cells 166MHz 65nm Technology 1.2V 484-Pin FBGA
M2S050T-Fgg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S050T-FGG484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
M2S050T-Fgg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S050T-FGG484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S050T-FGG484.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesFlash SizeRoHS StatusLead FreeSurface MountJESD-609 CodeNumber of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of InputsProgrammable Logic TypeNumber of Logic CellsHeight Seated (Max)LengthWidthView Compare
-
M2S050T-FGG4847 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA484484-FPBGA (23x23)0°C~85°C TJTray2009SmartFusion®2Active3 (168 Hours)85°C0°C166MHzM2S050TCAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 50K Logic Modules256KBRoHS CompliantContains Lead---------------------------
-
4 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGA--0°C~85°C TJTray2015SmartFusion®2Active3 (168 Hours)-----377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 50K Logic Modules256KBNon-RoHS Compliant-YESe0896Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliantNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377FIELD PROGRAMMABLE GATE ARRAY563402.44mm31mm31mm
-
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGA---40°C~100°C TJTray-SmartFusion®2Active3 (168 Hours)-----377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 50K Logic Modules256KBRoHS Compliant-YESe3896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm-NOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377FIELD PROGRAMMABLE GATE ARRAY563402.44mm31mm31mm
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-484-FPBGA (23x23)-40°C~100°C TJTray2009SmartFusion®2Active3 (168 Hours)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 25K Logic Modules256KBRoHS Compliant---------------------------
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
14 September 2023
TDA7297 VS TDA7266: What Is The Difference?
In audio equipment, the power amplifier is one of the crucial components. It can amplify low-voltage, low-current signals into high-voltage, high-current signals, thereby increasing output power. Among them,... -
15 September 2023
ATMEGA2560-16AU Footprint, Parameters and Application
Ⅰ. What is ATMEGA2560-16AU?ATMEGA2560-16AU is a powerful MCU microcontroller produced by Microchip Corporation of the United States. It uses the AVR CPU core, combined with a rich instruction... -
15 September 2023
Comparing LM741CN and UA741CN Operational Amplifiers
The two op amps, LM741CN and UA741CN, have similar functional and performance characteristics. They both feature single op amps and similar supply voltages and pinouts. However, they have... -
18 September 2023
TL074CN Symbol, Features and Package
Ⅰ. Overview of TL074CNⅡ. 3D Model and symbol of TL074CNⅢ. Footprint of TL074CNⅣ. Technical parametersⅤ. Features of TL074CNⅥ. Application of TL074CNⅦ. Package of TL074CNⅧ. How to optimize the...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.