Microsemi Corporation M2S025TS-FGG484I
- Part Number:
- M2S025TS-FGG484I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 4544185-M2S025TS-FGG484I
- Description:
- IC FPGA SOC 25K LUTS
- Datasheet:
- M2S025TS-FGG484I
Microsemi Corporation M2S025TS-FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S025TS-FGG484I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 2 weeks ago)
- Package / Case484-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B484
- Number of Outputs267
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O267
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs267
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 25K Logic Modules
- Number of Logic Cells27696
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 25K Logic Modules is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 267 I/Os.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.system on a chip benefits from 484 terminations.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip like this can have 267 outputs.There is 1.2V power supply requirement for this system on chip SoC.On the SoC chip, there are 267 inputs available for use.Logic system on chips features 27696 logic cells.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S025TS-FGG484I System On Chip (SoC) applications.
Embedded systems
POS Terminals
Microcontroller
Smartphones
Special Issue Editors
Central alarm system
AC-input BLDC motor drive
DC-input BLDC motor drive
High-end PLC
AC drive control module
A ARM? Cortex?-M3 core processor(s) is built into this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 25K Logic Modules is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 267 I/Os.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.system on a chip benefits from 484 terminations.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip like this can have 267 outputs.There is 1.2V power supply requirement for this system on chip SoC.On the SoC chip, there are 267 inputs available for use.Logic system on chips features 27696 logic cells.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S025TS-FGG484I System On Chip (SoC) applications.
Embedded systems
POS Terminals
Microcontroller
Smartphones
Special Issue Editors
Central alarm system
AC-input BLDC motor drive
DC-input BLDC motor drive
High-end PLC
AC drive control module
M2S025TS-FGG484I More Descriptions
M2S025Ts-Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S025TS-FGG484I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S025TS-FGG484I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusReach Compliance CodeSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
-
M2S025TS-FGG484I10 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)484-BGAYES-40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)484MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B484267Not Qualified1.26V1.2V1.14V267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA267FIELD PROGRAMMABLE GATE ARRAYFPGA - 25K Logic Modules27696256KB2.44mm23mm23mmRoHS Compliant---------
-
4 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES0°C~85°C TJTray2015SmartFusion®2e0Active3 (168 Hours)896Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmNon-RoHS Compliantnot_compliant-------
-
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTray-SmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant--------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant-484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
08 October 2023
2N3773 Transistor Equivalent, Features and Applications
Ⅰ. 2N3773 transistor overviewⅡ. Symbol and pin connection of 2N3773Ⅲ. Technical parametersⅣ. What are the features of 2N3773?Ⅴ. How does the 2N3773 achieve amplification and switching functions in... -
08 October 2023
IRFP260N Power Mosfet Transistor: Symbol, Features and Working Principle
Ⅰ. IRFP260N transistor descriptionⅡ. Symbol, footprint and pin connection of IRFP260NⅢ. Technical parametersⅣ. Features of IRFP260NⅤ. How does IRFP260N work and how does it drive IRFP260N?Ⅵ. Absolute maximum... -
09 October 2023
TIP117 Darlington Power Transistor Pinout, Equivalent, Features and Uses
Ⅰ. Overview of TIP117Ⅱ. The symbol, footprint and pinout of TIP117Ⅲ. Technical parameters of TIP117Ⅳ. What are the features of TIP117?Ⅴ. Package and packaging of TIP117Ⅵ. What are... -
09 October 2023
Lithium CR2450 Battery Symbol, Equivalent, Specifications and Uses
Ⅰ. What is CR2450 battery?Ⅱ. CR2450 symbol and footprintⅢ. Specifications of CR2450 batteryⅣ. What are the features of CR2450 battery?Ⅴ. What are the uses of CR2450 battery?Ⅵ. What...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.