M2S010TS-1VF256

Microsemi Corporation M2S010TS-1VF256

Part Number:
M2S010TS-1VF256
Manufacturer:
Microsemi Corporation
Ventron No:
3828057-M2S010TS-1VF256
Description:
IC FPGA SOC 10K LUTS
ECAD Model:
Datasheet:
M2S010TS-1VF256

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Specifications
Microsemi Corporation M2S010TS-1VF256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S010TS-1VF256.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    256-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Additional Feature
    LG-MIN, WD-MIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.8mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B256
  • Number of Outputs
    138
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    138
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    138
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 10K Logic Modules
  • Number of Logic Cells
    12084
  • Flash Size
    256KB
  • Height Seated (Max)
    1.56mm
  • Length
    14mm
  • Width
    14mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
Surface Mount is a type of technology used in electronic components where the device is mounted directly onto the surface of a printed circuit board. In this case, the device is designed to operate within a temperature range of 0°C to 85°C, making it suitable for use in a variety of environments. The device is packaged in a tray, which is a flat container used for storing and transporting electronic components. However, the peak reflow temperature for this device is not specified. The supply voltage for this device is 1.2V, and it requires a power supply of the same voltage. The device has a RAM size of 64KB and is equipped with an ARM® Cortex®-M3 core processor. It also has a flash size of 256KB and a width of 14mm. Overall, this device is compact, versatile, and designed to meet the demands of various electronic applications.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S010TS-1VF256 System On Chip (SoC) applications.

Automotive
DC-input BLDC motor drive
Self-aware system-on-chip (SoC)
Medical Pressure
Special Issue Information
Automated sorting equipment
Defense
Digital Media
Video Imaging
Medical
M2S010TS-1VF256 More Descriptions
M2S010Ts-1Vf256 256 Lfbga 14X14X1.56Mm Tray Rohs Compliant: Yes |Microchip M2S010TS-1VF256
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
Product Comparison
The three parts on the right have similar specifications to M2S010TS-1VF256.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Lifecycle Status
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S010TS-1VF256
    M2S010TS-1VF256
    10 Weeks
    256-LFBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    256
    Tin/Lead (Sn/Pb)
    LG-MIN, WD-MIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    0.8mm
    not_compliant
    NOT SPECIFIED
    S-PBGA-B256
    138
    Not Qualified
    1.26V
    1.2V
    1.14V
    138
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    138
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    12084
    256KB
    1.56mm
    14mm
    14mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S050T-FGG896I
    8 Weeks
    896-BGA
    YES
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    896
    MATTE TIN
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    NOT SPECIFIED
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    377
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    RoHS Compliant
    IN PRODUCTION (Last Updated: 2 weeks ago)
    -
    -
    -
    -
    -
    -
    -
  • M2S090S-1FGG484I
    -
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 90K Logic Modules
    -
    512KB
    -
    -
    -
    RoHS Compliant
    -
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S090S
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
  • M2S025T-1FGG484I
    10 Weeks
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    RoHS Compliant
    IN PRODUCTION (Last Updated: 1 month ago)
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S025T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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