Infineon Technologies IPD050N03LGATMA1
- Part Number:
- IPD050N03LGATMA1
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 2493106-IPD050N03LGATMA1
- Description:
- MOSFET N-CH 30V 50A TO252-3
- Datasheet:
- IPD050N03LGATMA1
Infineon Technologies IPD050N03LGATMA1 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies IPD050N03LGATMA1.
- Factory Lead Time18 Weeks
- Contact PlatingTin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / CaseTO-252-3, DPak (2 Leads Tab), SC-63
- Number of Pins3
- Transistor Element MaterialSILICON
- Operating Temperature-55°C~175°C TJ
- PackagingTape & Reel (TR)
- SeriesOptiMOS™
- Published2008
- JESD-609 Codee3
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations2
- ECCN CodeEAR99
- Additional FeatureAVALANCHE RATED, LOGIC LEVEL COMPATIBLE
- TechnologyMOSFET (Metal Oxide)
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reach Compliance Codenot_compliant
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- Pin Count4
- JESD-30 CodeR-PSSO-G2
- Qualification StatusNot Qualified
- Number of Elements1
- Power Dissipation-Max68W Tc
- Element ConfigurationSingle
- Operating ModeENHANCEMENT MODE
- Power Dissipation68W
- Case ConnectionDRAIN
- Turn On Delay Time6.7 ns
- FET TypeN-Channel
- Transistor ApplicationSWITCHING
- Rds On (Max) @ Id, Vgs5m Ω @ 30A, 10V
- Vgs(th) (Max) @ Id2.2V @ 250μA
- Halogen FreeHalogen Free
- Input Capacitance (Ciss) (Max) @ Vds3200pF @ 15V
- Current - Continuous Drain (Id) @ 25°C50A Tc
- Gate Charge (Qg) (Max) @ Vgs31nC @ 10V
- Rise Time13ns
- Drive Voltage (Max Rds On,Min Rds On)4.5V 10V
- Vgs (Max)±20V
- Fall Time (Typ)3.8 ns
- Turn-Off Delay Time25 ns
- Continuous Drain Current (ID)50A
- JEDEC-95 CodeTO-252AA
- Gate to Source Voltage (Vgs)20V
- Max Dual Supply Voltage30V
- Drain to Source Breakdown Voltage30V
- Avalanche Energy Rating (Eas)60 mJ
- Height2.41mm
- Length6.73mm
- Width6.22mm
- REACH SVHCNo SVHC
- RoHS StatusROHS3 Compliant
- Lead FreeContains Lead
IPD050N03LGATMA1 Overview
The MOSFET's breakdown is called "avalanche break down", and the avalanche energy applied to transistor is rated as 60 mJ (Eas).An op amp's input capacitance is defined as the capacitance between both of its input terminals with either input grounded, and 3200pF @ 15V is its maximum input capacitance.The drain current is the maximum continuous current the device can conduct, and this device has 50A continuous drain current (ID).A drainage-to-source breakdown voltage corresponds to the voltage at which a specified value of ID flows, where VGS is 30V, and this device has a drainage-to-source breakdown voltage of 30VV.Input capacitance must be charged before drain current conduction can begin, so the turn-off delay time is 25 ns.Before drain current conduction begins, the device's input capacitance must be charged, so the delay time is 6.7 ns.An FET transistor's gate-source voltage, VGS, indicates how much voltage is applied across the transistor's gate-source terminal and it can range from 20V to 1.In addition to 30V, it supports dual voltages up to the maximum.Using drive voltage (4.5V 10V), this device contributes to a reduction in overall power consumption.
IPD050N03LGATMA1 Features
the avalanche energy rating (Eas) is 60 mJ
a continuous drain current (ID) of 50A
a drain-to-source breakdown voltage of 30V voltage
the turn-off delay time is 25 ns
IPD050N03LGATMA1 Applications
There are a lot of Infineon Technologies
IPD050N03LGATMA1 applications of single MOSFETs transistors.
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
The MOSFET's breakdown is called "avalanche break down", and the avalanche energy applied to transistor is rated as 60 mJ (Eas).An op amp's input capacitance is defined as the capacitance between both of its input terminals with either input grounded, and 3200pF @ 15V is its maximum input capacitance.The drain current is the maximum continuous current the device can conduct, and this device has 50A continuous drain current (ID).A drainage-to-source breakdown voltage corresponds to the voltage at which a specified value of ID flows, where VGS is 30V, and this device has a drainage-to-source breakdown voltage of 30VV.Input capacitance must be charged before drain current conduction can begin, so the turn-off delay time is 25 ns.Before drain current conduction begins, the device's input capacitance must be charged, so the delay time is 6.7 ns.An FET transistor's gate-source voltage, VGS, indicates how much voltage is applied across the transistor's gate-source terminal and it can range from 20V to 1.In addition to 30V, it supports dual voltages up to the maximum.Using drive voltage (4.5V 10V), this device contributes to a reduction in overall power consumption.
IPD050N03LGATMA1 Features
the avalanche energy rating (Eas) is 60 mJ
a continuous drain current (ID) of 50A
a drain-to-source breakdown voltage of 30V voltage
the turn-off delay time is 25 ns
IPD050N03LGATMA1 Applications
There are a lot of Infineon Technologies
IPD050N03LGATMA1 applications of single MOSFETs transistors.
AC-DC Power Supply
Synchronous Rectification for ATX 1 Server I Telecom PSU
Motor drives and Uninterruptible Power Supplies
Micro Solar Inverter
DC/DC converters
Power Tools
Motor Drives and Uninterruptible Power Supples
Synchronous Rectification
Battery Protection Circuit
Telecom 1 Sever Power Supplies
IPD050N03LGATMA1 More Descriptions
Trans MOSFET N-CH 30V 50A 3-Pin(2 Tab) DPAK T/R
Power Field-Effect Transistor, 50A I(D), 30V, 0.0073ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA
MOSFET, N CH, 50A, 30V, PG-TO252-3; Transistor Polarity:N Channel; Continuous Drain Current Id:50A; Drain Source Voltage Vds:30V; On Resistance Rds(on):4.2mohm; Rds(on) Test Voltage Vgs:10V; Power Dissipation Pd:68W; Operating Temperature Range:-55°C to 175°C; Transistor Case Style:TO-252; No. of Pins:3; SVHC:No SVHC (20-Jun-2011); Current Id Max:50A; Power Dissipation Pd:68W; Transistor Type:Power MOSFET; Voltage Vgs Max:20V
Ultra low gate and output charge, together with lowest on-state resistance in small footprint packages, make OptiMOS™ 25V the best choice for the demanding requirements of voltage regulator solutions in servers, datacom and telecom applications, PG-TO252-3, RoHSInfineon SCT
With the new OptiMOS 30V product family, Infineon sets new standards in power density and energy efficiency for discrete power MOSFETs and system in package. | Summary of Features: Ultra low gate and output charge; Lowest on-state resistance in small footprint packages; Easy to design in | Benefits: Increased battery lifetime; Improved EMI behavior making external snubber networks obsolete; Saving costs; Saving space; Reducing power losses | Target Applications: Onboard charger; Notebook; Mainboard; DC-DC; VRD/VRM; Motor control; LED
Power Field-Effect Transistor, 50A I(D), 30V, 0.0073ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA
MOSFET, N CH, 50A, 30V, PG-TO252-3; Transistor Polarity:N Channel; Continuous Drain Current Id:50A; Drain Source Voltage Vds:30V; On Resistance Rds(on):4.2mohm; Rds(on) Test Voltage Vgs:10V; Power Dissipation Pd:68W; Operating Temperature Range:-55°C to 175°C; Transistor Case Style:TO-252; No. of Pins:3; SVHC:No SVHC (20-Jun-2011); Current Id Max:50A; Power Dissipation Pd:68W; Transistor Type:Power MOSFET; Voltage Vgs Max:20V
Ultra low gate and output charge, together with lowest on-state resistance in small footprint packages, make OptiMOS™ 25V the best choice for the demanding requirements of voltage regulator solutions in servers, datacom and telecom applications, PG-TO252-3, RoHSInfineon SCT
With the new OptiMOS 30V product family, Infineon sets new standards in power density and energy efficiency for discrete power MOSFETs and system in package. | Summary of Features: Ultra low gate and output charge; Lowest on-state resistance in small footprint packages; Easy to design in | Benefits: Increased battery lifetime; Improved EMI behavior making external snubber networks obsolete; Saving costs; Saving space; Reducing power losses | Target Applications: Onboard charger; Notebook; Mainboard; DC-DC; VRD/VRM; Motor control; LED
The three parts on the right have similar specifications to IPD050N03LGATMA1.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountMounting TypePackage / CaseNumber of PinsTransistor Element MaterialOperating TemperaturePackagingSeriesPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureTechnologyTerminal FormPeak Reflow Temperature (Cel)Reach Compliance CodeTime@Peak Reflow Temperature-Max (s)Pin CountJESD-30 CodeQualification StatusNumber of ElementsPower Dissipation-MaxElement ConfigurationOperating ModePower DissipationCase ConnectionTurn On Delay TimeFET TypeTransistor ApplicationRds On (Max) @ Id, VgsVgs(th) (Max) @ IdHalogen FreeInput Capacitance (Ciss) (Max) @ VdsCurrent - Continuous Drain (Id) @ 25°CGate Charge (Qg) (Max) @ VgsRise TimeDrive Voltage (Max Rds On,Min Rds On)Vgs (Max)Fall Time (Typ)Turn-Off Delay TimeContinuous Drain Current (ID)JEDEC-95 CodeGate to Source Voltage (Vgs)Max Dual Supply VoltageDrain to Source Breakdown VoltageAvalanche Energy Rating (Eas)HeightLengthWidthREACH SVHCRoHS StatusLead FreeSurface MountTerminal FinishSubcategoryTerminal PositionConfigurationDrain to Source Voltage (Vdss)Drain Current-Max (Abs) (ID)Drain-source On Resistance-MaxPulsed Drain Current-Max (IDM)DS Breakdown Voltage-MinView Compare
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IPD050N03LGATMA118 WeeksTinSurface MountSurface MountTO-252-3, DPak (2 Leads Tab), SC-633SILICON-55°C~175°C TJTape & Reel (TR)OptiMOS™2008e3noActive1 (Unlimited)2EAR99AVALANCHE RATED, LOGIC LEVEL COMPATIBLEMOSFET (Metal Oxide)GULL WINGNOT SPECIFIEDnot_compliantNOT SPECIFIED4R-PSSO-G2Not Qualified168W TcSingleENHANCEMENT MODE68WDRAIN6.7 nsN-ChannelSWITCHING5m Ω @ 30A, 10V2.2V @ 250μAHalogen Free3200pF @ 15V50A Tc31nC @ 10V13ns4.5V 10V±20V3.8 ns25 ns50ATO-252AA20V30V30V60 mJ2.41mm6.73mm6.22mmNo SVHCROHS3 CompliantContains Lead-----------
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----PG-TO252-3---Tape & Reel (TR)-----------------------------------------------RoHS Compliant-----------
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---Surface MountTO-252-3, DPak (2 Leads Tab), SC-63-SILICON-55°C~175°C TJTape & Reel (TR)OptiMOS™2008e3-Obsolete3 (168 Hours)2EAR99LOGIC LEVEL COMPATIBLEMOSFET (Metal Oxide)GULL WING260compliantNOT SPECIFIED4R-PSSO-G2Not Qualified194W Tc-ENHANCEMENT MODE-DRAIN-N-ChannelSWITCHING5.1m Ω @ 30A, 10V2V @ 50μA-3110pF @ 15V50A Tc25nC @ 5V-4.5V 10V±20V---TO-252AA---300 mJ----RoHS Compliant-YESMATTE TINFET General Purpose PowerSINGLESINGLE WITH BUILT-IN DIODE25V50A0.0084Ohm350A25V
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---Surface MountTO-252-3, DPak (2 Leads Tab), SC-63-SILICON-55°C~175°C TJTape & Reel (TR)OptiMOS™2008e3-Obsolete1 (Unlimited)2EAR99LOGIC LEVEL COMPATIBLEMOSFET (Metal Oxide)GULL WING260compliantNOT SPECIFIED4R-PSSO-G2Not Qualified1115W Tc-ENHANCEMENT MODE-DRAIN-N-ChannelSWITCHING3.2m Ω @ 60A, 10V2V @ 70μA-5200pF @ 15V90A Tc41nC @ 5V-4.5V 10V±20V---TO-252AA---300 mJ----RoHS Compliant-YESMATTE TINFET General Purpose PowerSINGLESINGLE WITH BUILT-IN DIODE25V90A0.0051Ohm360A25V
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