S70GL02GT11FHB023

Cypress Semiconductor Corp S70GL02GT11FHB023

Part Number:
S70GL02GT11FHB023
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
7373798-S70GL02GT11FHB023
Description:
GL-T Memory IC GL-T Series 13mm mm
ECAD Model:
Datasheet:
S70GL02GT11FHB023

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Specifications
Cypress Semiconductor Corp S70GL02GT11FHB023 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S70GL02GT11FHB023.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    64-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tape & Reel (TR)
  • Series
    GL-T
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    64
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B64
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    2Gb 256M x 8 128M x 16
  • Memory Type
    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Access Time
    110ns
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    128MX16
  • Memory Width
    16
  • Memory Density
    2147483648 bit
  • Screening Level
    AEC-Q100
  • Programming Voltage
    3V
  • Alternate Memory Width
    8
  • Length
    13mm
  • Height Seated (Max)
    1.4mm
  • Width
    11mm
  • RoHS Status
    ROHS3 Compliant
Description
S70GL02GT11FHB023 Overview
Non-Volatile is the type of memory it has. There is a Tape & Reel (TR) case available. The 64-LBGA case contains it. The chip has an 2Gb 256M x 8 128M x 16 memory. This device uses a FLASH-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 2.7V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. The chip has 64 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 3V of power. In its target applications, this memory ics plays an important role as a member of the GL-T series of memory devices. Nonvolatile memory arrays require 3V programming voltage to change their state.

S70GL02GT11FHB023 Features
Package / Case: 64-LBGA


S70GL02GT11FHB023 Applications
There are a lot of Cypress Semiconductor Corp
S70GL02GT11FHB023 Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
S70GL02GT11FHB023 More Descriptions
NOR Flash 2Gb 512M X 4Bit/1024M X 2Bit/2048M X 1Bit 110ns 64-Pin FBGA T/R
IC FLASH 2GBIT PARALLEL 64FBGA
Product Comparison
The three parts on the right have similar specifications to S70GL02GT11FHB023.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Access Time
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Memory Density
    Screening Level
    Programming Voltage
    Alternate Memory Width
    Length
    Height Seated (Max)
    Width
    RoHS Status
    HTS Code
    View Compare
  • S70GL02GT11FHB023
    S70GL02GT11FHB023
    13 Weeks
    Surface Mount
    64-LBGA
    YES
    -40°C~105°C TA
    Tape & Reel (TR)
    GL-T
    Active
    3 (168 Hours)
    64
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    NOT SPECIFIED
    1
    3V
    1mm
    NOT SPECIFIED
    R-PBGA-B64
    3.6V
    2.7V
    2Gb 256M x 8 128M x 16
    Non-Volatile
    ASYNCHRONOUS
    110ns
    FLASH
    Parallel
    128MX16
    16
    2147483648 bit
    AEC-Q100
    3V
    8
    13mm
    1.4mm
    11mm
    ROHS3 Compliant
    -
    -
  • S70GL02GT12FHAV13
    13 Weeks
    Surface Mount
    64-LBGA
    YES
    -40°C~105°C TA
    Tape & Reel (TR)
    Automotive, AEC-Q100, GL-T
    Active
    3 (168 Hours)
    64
    FLASH - NOR
    1.65V~3.6V
    BOTTOM
    NOT SPECIFIED
    1
    3V
    1mm
    NOT SPECIFIED
    R-PBGA-B64
    3.6V
    2.7V
    2Gb 256M x 8 128M x 16
    Non-Volatile
    ASYNCHRONOUS
    120ns
    FLASH
    Parallel
    128MX16
    16
    2147483648 bit
    -
    3V
    8
    13mm
    1.4mm
    11mm
    ROHS3 Compliant
    8542.32.00.51
  • S70GL02GT12FHAV10
    13 Weeks
    Surface Mount
    64-LBGA
    YES
    -40°C~105°C TA
    Tray
    Automotive, AEC-Q100, GL-T
    Active
    3 (168 Hours)
    64
    FLASH - NOR
    1.65V~3.6V
    BOTTOM
    NOT SPECIFIED
    1
    3V
    1mm
    NOT SPECIFIED
    R-PBGA-B64
    3.6V
    2.7V
    2Gb 256M x 8 128M x 16
    Non-Volatile
    ASYNCHRONOUS
    120ns
    FLASH
    Parallel
    128MX16
    16
    2147483648 bit
    -
    3V
    8
    13mm
    1.4mm
    11mm
    ROHS3 Compliant
    8542.32.00.51
  • S70GL02GT11FHV010
    13 Weeks
    Surface Mount
    64-LBGA
    YES
    -40°C~105°C TA
    Tray
    GL-T
    Active
    3 (168 Hours)
    64
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    NOT SPECIFIED
    1
    3V
    1mm
    NOT SPECIFIED
    R-PBGA-B64
    3.6V
    2.7V
    2Gb 256M x 8 128M x 16
    Non-Volatile
    ASYNCHRONOUS
    110ns
    FLASH
    Parallel
    128MX16
    16
    2147483648 bit
    -
    3V
    8
    13mm
    1.4mm
    11mm
    ROHS3 Compliant
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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