Macronix MX30UF4G28AC-XKI
- Part Number:
- MX30UF4G28AC-XKI
- Manufacturer:
- Macronix
- Ventron No:
- 7372251-MX30UF4G28AC-XKI
- Description:
- MXSMIO™ Memory IC MXSMIO™ Series 11mm mm
- Datasheet:
- MX30UF4G28AC-XKI
Macronix MX30UF4G28AC-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF4G28AC-XKI.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case63-VFBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTray
- SeriesMXSMIO™
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations63
- TechnologyFLASH - NAND (SLC)
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- JESD-30 CodeR-PBGA-B63
- Supply Voltage-Max (Vsup)1.95V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size4G 512M x 8
- Memory TypeNon-Volatile
- Operating ModeASYNCHRONOUS
- Memory FormatFLASH
- Memory InterfaceParallel
- Organization512MX8
- Memory Width8
- Write Cycle Time - Word, Page25ns
- Memory Density4294967296 bit
- Programming Voltage1.8V
- Length11mm
- Height Seated (Max)1mm
- Width9mm
- RoHS StatusROHS3 Compliant
MX30UF4G28AC-XKI Overview
Non-Volatile is the type of memory it has. There is a Tray case available. The 63-VFBGA case contains it. The chip has an 4G 512M x 8 memory. This device uses a FLASH-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 1.7V~1.95V can be supplied to memory ics. Its recommended mounting type is Surface Mount. The chip has 63 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 1.8V of power. In its target applications, this memory ics plays an important role as a member of the MXSMIO™ series of memory devices. Nonvolatile memory arrays require 1.8V programming voltage to change their state.
MX30UF4G28AC-XKI Features
Package / Case: 63-VFBGA
MX30UF4G28AC-XKI Applications
There are a lot of Macronix
MX30UF4G28AC-XKI Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
Non-Volatile is the type of memory it has. There is a Tray case available. The 63-VFBGA case contains it. The chip has an 4G 512M x 8 memory. This device uses a FLASH-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 1.7V~1.95V can be supplied to memory ics. Its recommended mounting type is Surface Mount. The chip has 63 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 1.8V of power. In its target applications, this memory ics plays an important role as a member of the MXSMIO™ series of memory devices. Nonvolatile memory arrays require 1.8V programming voltage to change their state.
MX30UF4G28AC-XKI Features
Package / Case: 63-VFBGA
MX30UF4G28AC-XKI Applications
There are a lot of Macronix
MX30UF4G28AC-XKI Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MX30UF4G28AC-XKI More Descriptions
Flash Memory 4Gbit 512M x 8 SLC NAND 1.8V 63-Pin VFBGA
IC FLASH 4GBIT PARALLEL 63VFBGA
IC FLASH 4GBIT PARALLEL 63VFBGA
The three parts on the right have similar specifications to MX30UF4G28AC-XKI.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageMemory DensityProgramming VoltageLengthHeight Seated (Max)WidthRoHS StatusTerminal FormOperating Temperature (Max)Operating Temperature (Min)Temperature GradeParallel/SerialMemory IC TypeAccess TimeJESD-609 CodeECCN CodeTerminal FinishHTS CodePeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)View Compare
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MX30UF4G28AC-XKI10 WeeksSurface Mount63-VFBGAYES-40°C~85°C TATrayMXSMIO™Active3 (168 Hours)63FLASH - NAND (SLC)1.7V~1.95VBOTTOM11.8V0.8mmR-PBGA-B631.95V1.7V4G 512M x 8Non-VolatileASYNCHRONOUSFLASHParallel512MX8825ns4294967296 bit1.8V11mm1mm9mmROHS3 Compliant--------------
-
8 Weeks--YES-Tray-Active-48CMOS-DUAL13.3V0.5mmR-PDSO-G483.6V2.7V--ASYNCHRONOUS--256MX88-2147483648 bit3V18.4mm1.2mm12mm-GULL WING85°C-40°CINDUSTRIALPARALLELFLASH-------
-
8 WeeksSurface Mount63-VFBGAYES-40°C~85°C TATape & Reel (TR)MXSMIO™Active3 (168 Hours)63FLASH - NAND (SLC)1.7V~1.95VBOTTOM11.8V0.8mmR-PBGA-B631.95V1.7V4Gb 256M x 16Non-VolatileASYNCHRONOUSFLASHParallel256MX1616600μs, 25ns4294967296 bit1.8V11mm1mm9mmROHS3 Compliant------25ns------
-
---YES-Tray-Not For New Designs3 (168 Hours)48CMOS-DUAL11.8V0.5mmR-PDSO-G481.95V1.7V--ASYNCHRONOUS--512MX88-4294967296 bit1.8V18.4mm1.2mm12mmRoHS CompliantGULL WING85°C-40°CINDUSTRIALPARALLELFLASH-e33A991.B.1.AMatte Tin (Sn)8542.32.00.5126040
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