Macronix MX30UF1G18AC-XQI
- Part Number:
- MX30UF1G18AC-XQI
- Manufacturer:
- Macronix
- Ventron No:
- 7372077-MX30UF1G18AC-XQI
- Description:
- Memory IC 8mm mm
- Datasheet:
- MX30UF1G18AC-XQI
Macronix MX30UF1G18AC-XQI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF1G18AC-XQI.
- Factory Lead Time8 Weeks
- Surface MountYES
- PackagingTray
- Part StatusActive
- Number of Terminations48
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)40
- JESD-30 CodeR-PBGA-B48
- Operating Temperature (Max)85°C
- Operating Temperature (Min)-40°C
- Supply Voltage-Max (Vsup)1.95V
- Temperature GradeINDUSTRIAL
- Supply Voltage-Min (Vsup)1.7V
- Operating ModeASYNCHRONOUS
- Organization128MX8
- Memory Width8
- Memory Density1073741824 bit
- Parallel/SerialPARALLEL
- Memory IC TypeFLASH
- Programming Voltage1.8V
- Length8mm
- Height Seated (Max)1mm
- Width6mm
- RoHS StatusRoHS Compliant
MX30UF1G18AC-XQI Overview
The case comes in Tray size. On the chip, there are 48 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 1.8V is required for the operation of this memory device. A programming voltage of 1.8V is required to alter the state of certain nonvolatile memory arrays. FLASH is the type of memory IC in this chip. Using ic memory chip above 85°C is recommended. Ic memory chip is designed to operate at a temperature of -40°C, otherwise the part will malfunction
MX30UF1G18AC-XQI Features
MX30UF1G18AC-XQI Applications
There are a lot of Macronix
MX30UF1G18AC-XQI Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
The case comes in Tray size. On the chip, there are 48 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 1.8V is required for the operation of this memory device. A programming voltage of 1.8V is required to alter the state of certain nonvolatile memory arrays. FLASH is the type of memory IC in this chip. Using ic memory chip above 85°C is recommended. Ic memory chip is designed to operate at a temperature of -40°C, otherwise the part will malfunction
MX30UF1G18AC-XQI Features
MX30UF1G18AC-XQI Applications
There are a lot of Macronix
MX30UF1G18AC-XQI Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
MX30UF1G18AC-XQI More Descriptions
IC FLASH 1GBIT PARALLEL 48VFBGA
The three parts on the right have similar specifications to MX30UF1G18AC-XQI.
-
ImagePart NumberManufacturerFactory Lead TimeSurface MountPackagingPart StatusNumber of TerminationsTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeOperating Temperature (Max)Operating Temperature (Min)Supply Voltage-Max (Vsup)Temperature GradeSupply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityParallel/SerialMemory IC TypeProgramming VoltageLengthHeight Seated (Max)WidthRoHS StatusMounting TypePackage / CaseOperating TemperatureSeriesMoisture Sensitivity Level (MSL)Voltage - SupplyMemory SizeMemory TypeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageJESD-609 CodeTerminal FinishAccess TimeView Compare
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MX30UF1G18AC-XQI8 WeeksYESTrayActive48CMOSBOTTOMBALL26011.8V0.8mm40R-PBGA-B4885°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS128MX881073741824 bitPARALLELFLASH1.8V8mm1mm6mmRoHS Compliant---------------
-
--TrayDiscontinued-FLASH - NAND (SLC)-------------------1.8V---ROHS3 CompliantSurface Mount48-TFSOP (0.488, 12.40mm Width)-40°C~85°C TAMX30UF3 (168 Hours)1.7V~1.95V4Gb 512M x 8Non-VolatileFLASHParallel25ns---
-
8 WeeksYESTrayActive48CMOSDUALGULL WING26011.8V0.5mm40R-PDSO-G4885°C-40°C1.95VINDUSTRIAL1.7VASYNCHRONOUS256MX882147483648 bitPARALLELFLASH1.8V18.4mm1.2mm12mmRoHS Compliant----3 (168 Hours)------e3Matte Tin (Sn)-
-
8 WeeksYESTape & Reel (TR)Active63FLASH - NAND (SLC)BOTTOM--11.8V0.8mm-R-PBGA-B63--1.95V-1.7VASYNCHRONOUS256MX16164294967296 bit--1.8V11mm1mm9mmROHS3 CompliantSurface Mount63-VFBGA-40°C~85°C TAMXSMIO™3 (168 Hours)1.7V~1.95V4Gb 256M x 16Non-VolatileFLASHParallel600μs, 25ns--25ns
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