MX30UF1G18AC-XQI

Macronix MX30UF1G18AC-XQI

Part Number:
MX30UF1G18AC-XQI
Manufacturer:
Macronix
Ventron No:
7372077-MX30UF1G18AC-XQI
Description:
Memory IC 8mm mm
ECAD Model:
Datasheet:
MX30UF1G18AC-XQI

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Macronix MX30UF1G18AC-XQI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF1G18AC-XQI.
  • Factory Lead Time
    8 Weeks
  • Surface Mount
    YES
  • Packaging
    Tray
  • Part Status
    Active
  • Number of Terminations
    48
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B48
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    1.95V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    128MX8
  • Memory Width
    8
  • Memory Density
    1073741824 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    1.8V
  • Length
    8mm
  • Height Seated (Max)
    1mm
  • Width
    6mm
  • RoHS Status
    RoHS Compliant
Description
MX30UF1G18AC-XQI Overview
The case comes in Tray size. On the chip, there are 48 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 1.8V is required for the operation of this memory device. A programming voltage of 1.8V is required to alter the state of certain nonvolatile memory arrays. FLASH is the type of memory IC in this chip. Using ic memory chip above 85°C is recommended. Ic memory chip is designed to operate at a temperature of -40°C, otherwise the part will malfunction

MX30UF1G18AC-XQI Features


MX30UF1G18AC-XQI Applications
There are a lot of Macronix
MX30UF1G18AC-XQI Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
MX30UF1G18AC-XQI More Descriptions
IC FLASH 1GBIT PARALLEL 48VFBGA
Product Comparison
The three parts on the right have similar specifications to MX30UF1G18AC-XQI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    Part Status
    Number of Terminations
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Mounting Type
    Package / Case
    Operating Temperature
    Series
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Memory Size
    Memory Type
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    JESD-609 Code
    Terminal Finish
    Access Time
    View Compare
  • MX30UF1G18AC-XQI
    MX30UF1G18AC-XQI
    8 Weeks
    YES
    Tray
    Active
    48
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    128MX8
    8
    1073741824 bit
    PARALLEL
    FLASH
    1.8V
    8mm
    1mm
    6mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF4G18AC-TI
    -
    -
    Tray
    Discontinued
    -
    FLASH - NAND (SLC)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1.8V
    -
    -
    -
    ROHS3 Compliant
    Surface Mount
    48-TFSOP (0.488, 12.40mm Width)
    -40°C~85°C TA
    MX30UF
    3 (168 Hours)
    1.7V~1.95V
    4Gb 512M x 8
    Non-Volatile
    FLASH
    Parallel
    25ns
    -
    -
    -
  • MX30UF2G18AC-TI
    8 Weeks
    YES
    Tray
    Active
    48
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    -
    -
    -
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    e3
    Matte Tin (Sn)
    -
  • MX30UF4G16AC-XKI
    8 Weeks
    YES
    Tape & Reel (TR)
    Active
    63
    FLASH - NAND (SLC)
    BOTTOM
    -
    -
    1
    1.8V
    0.8mm
    -
    R-PBGA-B63
    -
    -
    1.95V
    -
    1.7V
    ASYNCHRONOUS
    256MX16
    16
    4294967296 bit
    -
    -
    1.8V
    11mm
    1mm
    9mm
    ROHS3 Compliant
    Surface Mount
    63-VFBGA
    -40°C~85°C TA
    MXSMIO™
    3 (168 Hours)
    1.7V~1.95V
    4Gb 256M x 16
    Non-Volatile
    FLASH
    Parallel
    600μs, 25ns
    -
    -
    25ns
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.