MX30UF1G18AC-XKI

Macronix MX30UF1G18AC-XKI

Part Number:
MX30UF1G18AC-XKI
Manufacturer:
Macronix
Ventron No:
7371781-MX30UF1G18AC-XKI
Description:
Memory IC 11mm mm
ECAD Model:
Datasheet:
MX30UF1G18AC-XKI

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Specifications
Macronix MX30UF1G18AC-XKI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF1G18AC-XKI.
  • Factory Lead Time
    8 Weeks
  • Surface Mount
    YES
  • Packaging
    Tray
  • Part Status
    Active
  • Number of Terminations
    63
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B63
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    1.95V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    128MX8
  • Memory Width
    8
  • Memory Density
    1073741824 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    1.8V
  • Length
    11mm
  • Height Seated (Max)
    1mm
  • Width
    9mm
  • RoHS Status
    Non-RoHS Compliant
Description
MX30UF1G18AC-XKI Overview
In addition, memory ics is available in a Tray case as well. On the chip, there are 63 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 1.8V. There is a need for a programming voltage of 1.8V in order to modify the state of some nonvolatile memory arrays. This chip has the memory IC type FLASH. Only use it above 85°C. The part is designed to operate at a temperature of -40°C, in any other case, it would malfunction.

MX30UF1G18AC-XKI Features


MX30UF1G18AC-XKI Applications
There are a lot of Macronix
MX30UF1G18AC-XKI Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
MX30UF1G18AC-XKI More Descriptions
R-PBGA-B63 INDUSTRIAL Tray 128MX8 ic memory 9mm 1073741824bit 1.7V 85C
NAND Flash Parallel 1.8V 1G-bit 128M x 8 25ns 63-Pin VFBGA
1.7V~1.95V 1Gbit VBGA-63 NAND FLASH ROHS
IC FLASH 1GBIT PARALLEL 63VFBGA
Product Comparison
The three parts on the right have similar specifications to MX30UF1G18AC-XKI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    Part Status
    Number of Terminations
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Published
    JESD-609 Code
    ECCN Code
    Terminal Finish
    HTS Code
    Lead Free
    Moisture Sensitivity Level (MSL)
    View Compare
  • MX30UF1G18AC-XKI
    MX30UF1G18AC-XKI
    8 Weeks
    YES
    Tray
    Active
    63
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B63
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    128MX8
    8
    1073741824 bit
    PARALLEL
    FLASH
    1.8V
    11mm
    1mm
    9mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30LF2G28AC-TI
    8 Weeks
    YES
    Tray
    Active
    48
    CMOS
    DUAL
    GULL WING
    -
    1
    3.3V
    0.5mm
    -
    R-PDSO-G48
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    2.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    3V
    18.4mm
    1.2mm
    12mm
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF4G18AB-XKI
    -
    YES
    Tray
    Not For New Designs
    63
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B63
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    11mm
    1mm
    9mm
    Non-RoHS Compliant
    2014
    e1
    3A991.B.1.A
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.32.00.51
    Lead Free
    -
  • MX30UF4G18AB-TI
    -
    YES
    Tray
    Not For New Designs
    48
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    e3
    3A991.B.1.A
    Matte Tin (Sn)
    8542.32.00.51
    -
    3 (168 Hours)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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