Macronix MX30UF1G16AC-XQI
- Part Number:
- MX30UF1G16AC-XQI
- Manufacturer:
- Macronix
- Ventron No:
- 7372086-MX30UF1G16AC-XQI
- Description:
- Memory IC 8mm mm
- Datasheet:
- MX30UF1G16AC-XQI
Macronix MX30UF1G16AC-XQI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30UF1G16AC-XQI.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case48-VFBGA
- Surface MountYES
- PackagingTray
- Part StatusActive
- Number of Terminations48
- TechnologyFLASH - NAND (SLC)
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)40
- JESD-30 CodeR-PBGA-B48
- Operating Temperature (Max)85°C
- Operating Temperature (Min)-40°C
- Supply Voltage-Max (Vsup)1.95V
- Temperature GradeINDUSTRIAL
- Supply Voltage-Min (Vsup)1.7V
- Memory Size1Gb 64M x 16
- Memory TypeNon-Volatile
- Operating ModeASYNCHRONOUS
- Memory FormatFLASH
- Organization64MX16
- Memory Width16
- Memory Density1073741824 bit
- Parallel/SerialPARALLEL
- Programming Voltage1.8V
- Length8mm
- Height Seated (Max)1mm
- Width6mm
- RoHS StatusRoHS Compliant
MX30UF1G16AC-XQI Overview
Non-Volatile is its memory type. It is available in a case with a Tray shape. As you can see, it is embedded in 48-VFBGA case. There is an 1Gb 64M x 16 memory capacity on the chip. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. There is a recommendation that Surface Mount mounting type should be used for this product. As you can see from the diagram, the chip is planted with 48 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 1.8V power supply. A programming voltage of 1.8V is needed to alter the state of certain nonvolatile memory arrays. If the temperature is greater than 85°C, you should not use it. As far as the part is concerned, it should be used only at a temperature of -40°C, otherwise it can fail.
MX30UF1G16AC-XQI Features
Package / Case: 48-VFBGA
MX30UF1G16AC-XQI Applications
There are a lot of Macronix
MX30UF1G16AC-XQI Memory applications.
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
Non-Volatile is its memory type. It is available in a case with a Tray shape. As you can see, it is embedded in 48-VFBGA case. There is an 1Gb 64M x 16 memory capacity on the chip. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. There is a recommendation that Surface Mount mounting type should be used for this product. As you can see from the diagram, the chip is planted with 48 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 1.8V power supply. A programming voltage of 1.8V is needed to alter the state of certain nonvolatile memory arrays. If the temperature is greater than 85°C, you should not use it. As far as the part is concerned, it should be used only at a temperature of -40°C, otherwise it can fail.
MX30UF1G16AC-XQI Features
Package / Case: 48-VFBGA
MX30UF1G16AC-XQI Applications
There are a lot of Macronix
MX30UF1G16AC-XQI Memory applications.
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
MX30UF1G16AC-XQI More Descriptions
NAND Flash Memory 1Gbit Capacity 64Mx16bit Organization 1.8V Supply Voltage Surface Mount 48-Ball VFBGA
IC FLASH 1GBIT PARALLEL 48VFBGA
IC FLASH 1GBIT PARALLEL 48VFBGA
The three parts on the right have similar specifications to MX30UF1G16AC-XQI.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountPackagingPart StatusNumber of TerminationsTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeOperating Temperature (Max)Operating Temperature (Min)Supply Voltage-Max (Vsup)Temperature GradeSupply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeMemory FormatOrganizationMemory WidthMemory DensityParallel/SerialProgramming VoltageLengthHeight Seated (Max)WidthRoHS StatusMemory IC TypePublishedJESD-609 CodeECCN CodeTerminal FinishHTS CodeLead FreeMoisture Sensitivity Level (MSL)View Compare
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MX30UF1G16AC-XQI8 WeeksSurface Mount48-VFBGAYESTrayActive48FLASH - NAND (SLC)BOTTOMBALL26011.8V0.8mm40R-PBGA-B4885°C-40°C1.95VINDUSTRIAL1.7V1Gb 64M x 16Non-VolatileASYNCHRONOUSFLASH64MX16161073741824 bitPARALLEL1.8V8mm1mm6mmRoHS Compliant---------
-
8 Weeks--YESTrayActive48CMOSDUALGULL WING-13.3V0.5mm-R-PDSO-G4885°C-40°C3.6VINDUSTRIAL2.7V--ASYNCHRONOUS-256MX882147483648 bitPARALLEL3V18.4mm1.2mm12mm-FLASH-------
-
---YESTrayNot For New Designs63CMOSBOTTOMBALL26011.8V0.8mm40R-PBGA-B6385°C-40°C1.95VINDUSTRIAL1.7V--ASYNCHRONOUS-512MX884294967296 bitPARALLEL1.8V11mm1mm9mmNon-RoHS CompliantFLASH2014e13A991.B.1.ATin/Silver/Copper (Sn/Ag/Cu)8542.32.00.51Lead Free-
-
---YESTrayNot For New Designs48CMOSDUALGULL WING26011.8V0.5mm40R-PDSO-G4885°C-40°C1.95VINDUSTRIAL1.7V--ASYNCHRONOUS-512MX884294967296 bitPARALLEL1.8V18.4mm1.2mm12mmRoHS CompliantFLASH-e33A991.B.1.AMatte Tin (Sn)8542.32.00.51-3 (168 Hours)
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