MX30LF2GE8AB-TI

Macronix MX30LF2GE8AB-TI

Part Number:
MX30LF2GE8AB-TI
Manufacturer:
Macronix
Ventron No:
7372415-MX30LF2GE8AB-TI
Description:
Memory IC 18.4mm mm
ECAD Model:
Datasheet:
MX30LF2GE8AB-TI

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Specifications
Macronix MX30LF2GE8AB-TI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30LF2GE8AB-TI.
  • Factory Lead Time
    8 Weeks
  • Surface Mount
    YES
  • Packaging
    Tray
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • Terminal Finish
    MATTE TIN
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PDSO-G48
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    3.6V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    256MX8
  • Memory Width
    8
  • Memory Density
    2147483648 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    2.7V
  • Length
    18.4mm
  • Height Seated (Max)
    1.2mm
  • Width
    12mm
  • RoHS Status
    Non-RoHS Compliant
Description
MX30LF2GE8AB-TI Overview
The case comes in Tray size. On the chip, there are 48 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 3V is required for the operation of this memory device. A programming voltage of 2.7V is required to alter the state of certain nonvolatile memory arrays. FLASH is the type of memory IC in this chip. Using ic memory chip above 85°C is recommended. Ic memory chip is designed to operate at a temperature of -40°C, otherwise the part will malfunctionWe generally refer to this device as a NAND TYPE device because that is what we call it in the industry.

MX30LF2GE8AB-TI Features


MX30LF2GE8AB-TI Applications
There are a lot of Macronix
MX30LF2GE8AB-TI Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
MX30LF2GE8AB-TI More Descriptions
SLC NAND Flash Parallel 3.3V 2Gbit 256M x 8bit 25ns 48-Pin TSOP
IC FLASH 2GBIT PARALLEL 48TSOP
Product Description Demo for Development.
Product Comparison
The three parts on the right have similar specifications to MX30LF2GE8AB-TI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Published
    ECCN Code
    HTS Code
    Lead Free
    View Compare
  • MX30LF2GE8AB-TI
    MX30LF2GE8AB-TI
    8 Weeks
    YES
    Tray
    e3
    Active
    3 (168 Hours)
    48
    MATTE TIN
    CMOS
    DUAL
    GULL WING
    260
    1
    3V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    2.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    2.7V
    18.4mm
    1.2mm
    12mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
  • MX30UF2G16AC-XQI
    8 Weeks
    YES
    Tray
    -
    Active
    -
    48
    -
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    128MX16
    16
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    8mm
    1mm
    6mm
    RoHS Compliant
    -
    -
    -
    -
  • MX30UF4G18AB-XKI
    -
    YES
    Tray
    e1
    Not For New Designs
    -
    63
    Tin/Silver/Copper (Sn/Ag/Cu)
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.8mm
    40
    R-PBGA-B63
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    1.8V
    11mm
    1mm
    9mm
    Non-RoHS Compliant
    2014
    3A991.B.1.A
    8542.32.00.51
    Lead Free
  • MX30LF4GE8AB-TI
    8 Weeks
    YES
    Tray
    e3
    Active
    3 (168 Hours)
    48
    MATTE TIN
    CMOS
    DUAL
    GULL WING
    260
    1
    3V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    2.7V
    ASYNCHRONOUS
    512MX8
    8
    4294967296 bit
    PARALLEL
    FLASH
    2.7V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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