MX30LF1GE8AB-TI

Macronix MX30LF1GE8AB-TI

Part Number:
MX30LF1GE8AB-TI
Manufacturer:
Macronix
Ventron No:
7372029-MX30LF1GE8AB-TI
Description:
Memory IC 18.4mm mm
ECAD Model:
Datasheet:
MX30LF1GE8AB-TI

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Specifications
Macronix MX30LF1GE8AB-TI technical specifications, attributes, parameters and parts with similar specifications to Macronix MX30LF1GE8AB-TI.
  • Factory Lead Time
    8 Weeks
  • Surface Mount
    YES
  • Packaging
    Tray
  • Published
    2015
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • Terminal Finish
    Matte Tin (Sn)
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PDSO-G48
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    3.6V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.7V
  • Operating Mode
    ASYNCHRONOUS
  • Organization
    128MX8
  • Memory Width
    8
  • Memory Density
    1073741824 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage
    2.7V
  • Length
    18.4mm
  • Height Seated (Max)
    1.2mm
  • Width
    12mm
  • RoHS Status
    Non-RoHS Compliant
Description
MX30LF1GE8AB-TI Overview
Case Tray is available. It is planted on the chip with 48 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 3V to be supplied to this ic memory chip in order to operate. Nonvolatile memory arrays require 2.7V programming voltages to change their states. A FLASH-type memory IC is used in this chip. Temperatures above 85°C are the only conditions for its use. This part is required to be operated at a temperature at -40°C, otherwise it won't work. Generally speaking, a NAND TYPE device is what we refer to as a wireless communication device.

MX30LF1GE8AB-TI Features


MX30LF1GE8AB-TI Applications
There are a lot of Macronix
MX30LF1GE8AB-TI Memory applications.


networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
MX30LF1GE8AB-TI More Descriptions
1Gb (128M x 8) Parallel 20 ns FLASH NAND Memory IC - TSOP-48
SLC NAND Flash Parallel 3.3V 1Gbit 128M x 8bit 48-Pin TSOP-I
R-PDSO-G48 INDUSTRIAL Tray 128MX8 ic memory 12mm 1073741824bit 2.7V 85C
Product Comparison
The three parts on the right have similar specifications to MX30LF1GE8AB-TI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Mounting Type
    Package / Case
    Operating Temperature
    Series
    Voltage - Supply
    Memory Size
    Memory Type
    Access Time
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    View Compare
  • MX30LF1GE8AB-TI
    MX30LF1GE8AB-TI
    8 Weeks
    YES
    Tray
    2015
    e3
    Active
    3 (168 Hours)
    48
    Matte Tin (Sn)
    CMOS
    DUAL
    GULL WING
    260
    1
    3V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    2.7V
    ASYNCHRONOUS
    128MX8
    8
    1073741824 bit
    PARALLEL
    FLASH
    2.7V
    18.4mm
    1.2mm
    12mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30LF2G18SC-XKI
    8 Weeks
    -
    Tray
    -
    -
    Active
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF2G18AC-TI
    8 Weeks
    YES
    Tray
    -
    e3
    Active
    3 (168 Hours)
    48
    Matte Tin (Sn)
    CMOS
    DUAL
    GULL WING
    260
    1
    1.8V
    0.5mm
    40
    R-PDSO-G48
    85°C
    -40°C
    1.95V
    INDUSTRIAL
    1.7V
    ASYNCHRONOUS
    256MX8
    8
    2147483648 bit
    PARALLEL
    FLASH
    1.8V
    18.4mm
    1.2mm
    12mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX30UF4G16AC-XKI
    8 Weeks
    YES
    Tape & Reel (TR)
    -
    -
    Active
    3 (168 Hours)
    63
    -
    FLASH - NAND (SLC)
    BOTTOM
    -
    -
    1
    1.8V
    0.8mm
    -
    R-PBGA-B63
    -
    -
    1.95V
    -
    1.7V
    ASYNCHRONOUS
    256MX16
    16
    4294967296 bit
    -
    -
    1.8V
    11mm
    1mm
    9mm
    ROHS3 Compliant
    Surface Mount
    63-VFBGA
    -40°C~85°C TA
    MXSMIO™
    1.7V~1.95V
    4Gb 256M x 16
    Non-Volatile
    25ns
    FLASH
    Parallel
    600μs, 25ns
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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