Xilinx Inc. XCZU9EG-1FFVB1156E
- Part Number:
- XCZU9EG-1FFVB1156E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3668956-XCZU9EG-1FFVB1156E
- Description:
- IC FPGA 328 I/O 1156FCBGA
- Datasheet:
- XCZU9EG-1FFVB1156E
Xilinx Inc. XCZU9EG-1FFVB1156E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU9EG-1FFVB1156E.
- Factory Lead Time11 Weeks
- Package / Case1156-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2013
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O328
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 599K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The manufacturer of this component is Xilinx Inc. It is a type of chip called an Embedded - System On Chip (SoC), which falls under the category of Embedded - System On Chip (SoC). The package or case size is 1156-BBGA, FCBGA, and it is packaged in a tray. It belongs to the Zynq® UltraScale ™ MPSoC EG series. The Moisture Sensitivity Level (MSL) is 4, meaning it can withstand 72 hours of exposure to moisture. The HTS Code is 8542.31.00.01. The peak reflow temperature is not specified. The core processor consists of a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2. The chip also includes peripherals such as DMA and WDT. Its architecture is a combination of MCU and FPGA. The RoHS status is ROHS3 Compliant, meaning it meets the requirements of the Restriction of Hazardous Substances directive.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9EG-1FFVB1156E System On Chip (SoC) applications.
Cyber security for critical applications in the aerospace
Measurement testers
Personal Computers
Print Special Issue Flyer
Industrial transport
Vending machines
POS Terminals
Wireless sensor networks
Wireless networking
Robotics
The manufacturer of this component is Xilinx Inc. It is a type of chip called an Embedded - System On Chip (SoC), which falls under the category of Embedded - System On Chip (SoC). The package or case size is 1156-BBGA, FCBGA, and it is packaged in a tray. It belongs to the Zynq® UltraScale ™ MPSoC EG series. The Moisture Sensitivity Level (MSL) is 4, meaning it can withstand 72 hours of exposure to moisture. The HTS Code is 8542.31.00.01. The peak reflow temperature is not specified. The core processor consists of a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2. The chip also includes peripherals such as DMA and WDT. Its architecture is a combination of MCU and FPGA. The RoHS status is ROHS3 Compliant, meaning it meets the requirements of the Restriction of Hazardous Substances directive.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9EG-1FFVB1156E System On Chip (SoC) applications.
Cyber security for critical applications in the aerospace
Measurement testers
Personal Computers
Print Special Issue Flyer
Industrial transport
Vending machines
POS Terminals
Wireless sensor networks
Wireless networking
Robotics
XCZU9EG-1FFVB1156E More Descriptions
FPGA Zynq UltraScale Family 599550 Cells 20nm Technology 0.95V 1156-Pin FC-BGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 600K, B1156, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 600K, B1156, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU9EG-1FFVB1156E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusView Compare
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XCZU9EG-1FFVB1156E11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant-
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11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
-
11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
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