XCZU9CG-1FFVC900E

Xilinx Inc. XCZU9CG-1FFVC900E

Part Number:
XCZU9CG-1FFVC900E
Manufacturer:
Xilinx Inc.
Ventron No:
3162349-XCZU9CG-1FFVC900E
Description:
IC FPGA 204 I/O 900FCBGA
ECAD Model:
Datasheet:
XCZU9CG-1FFVC900E

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Specifications
Xilinx Inc. XCZU9CG-1FFVC900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU9CG-1FFVC900E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    204
  • Speed
    500MHz, 1.2GHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Zynq® UltraScale ™ MPSoC CG is a highly advanced and versatile series designed for a wide range of applications. This product is currently in active status, ensuring continued availability and support. With a Moisture Sensitivity Level (MSL) of 4 (72 hours), it can withstand moderate levels of moisture exposure. The product is classified under HTS Code 8542.31.00.01, making it suitable for export to various countries. The peak reflow temperature for this series is not specified, providing flexibility for different assembly processes. It boasts 204 I/Os and a speed range of 500MHz to 1.2GHz, making it capable of handling complex tasks efficiently. The series also features various peripherals such as DMA and WDT, along with connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Its primary attribute is the Zynq® UltraScale ™ FPGA, which offers over 599K logic cells for high-performance processing.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU9CG-1FFVC900E System On Chip (SoC) applications.

Networked sensors
POS Terminals
Temperature
Test and Measurement
Industrial automation devices
sequence controllers
Industrial sectors
Embedded systems
Multiprocessor system-on-chips (MPSoCs)
Servo drive control module
XCZU9CG-1FFVC900E More Descriptions
FPGA Zynq UltraScale Family 599550 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 600K, C900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU9CG-1FFVC900E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    Published
    View Compare
  • XCZU9CG-1FFVC900E
    XCZU9CG-1FFVC900E
    11 Weeks
    900-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 1.2GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    YES
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B625
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
    -
  • XCZU9EG-1FFVC900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    2013
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    2016
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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