Xilinx Inc. XCZU7EG-1FBVB900I
- Part Number:
- XCZU7EG-1FBVB900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3668955-XCZU7EG-1FBVB900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU7EG-1FBVB900I
Xilinx Inc. XCZU7EG-1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU7EG-1FBVB900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 504K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - System On Chip (SoC) chips. This particular chip, belonging to the Embedded - System On Chip (SoC) category, is highly sought after for its advanced features and capabilities. The package or case of this chip is 900-BBGA, FCBGA, making it compact and efficient for use in various electronic devices. It was first published in 2016, which means it has been in the market for a few years and has undergone rigorous testing and improvements to ensure its quality and performance. One important aspect to consider when using this chip is its Moisture Sensitivity Level (MSL), which is rated at 4 (72 Hours). This indicates that the chip can withstand exposure to moisture for up to 72 hours without any damage, making it suitable for use in various environments. Another important parameter to note is the Peak Reflow Temperature (Cel) and Reflow Temperature-Max (s), which are not specified for this chip. This means that the chip can handle a wide range of temperatures, making it versatile and reliable for different applications. With 204 I/Os, this chip offers a high level of connectivity and can support multiple devices and peripherals. It also boasts impressive speeds of 500MHz, 600MHz, and 1.2GHz, making it ideal for demanding tasks and applications. The core processor of this chip is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2. This powerful combination of processors allows for efficient multitasking and high-speed processing. In terms of peripherals, this chip offers DMA (Direct Memory Access) and WDT (Watchdog Timer), which are essential for data transfer and system monitoring. This ensures smooth and reliable operation of the chip in various devices. Additionally, this chip is also ROHS3 compliant, meaning it meets the latest environmental standards and regulations, making it a sustainable and eco-friendly option for electronic devices. In conclusion, the Xilinx Inc. Embedded - System On Chip (SoC) chip is a top-of-the-line product that offers advanced features, high speeds, and efficient performance. Its compact size, moisture resistance, and wide temperature range make it suitable for various applications. With its powerful processors and essential peripherals, this chip is a reliable and sustainable choice for electronic devices.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU7EG-1FBVB900I System On Chip (SoC) applications.
Sensor network-on-chip (sNoC)
Industrial Pressure
Industrial automation devices
Temperature
Servo drive control module
Optical drive
Smartphone accessories
Healthcare
Functional safety for critical applications in the automotive
Communication network-on-Chip (cNoC)
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - System On Chip (SoC) chips. This particular chip, belonging to the Embedded - System On Chip (SoC) category, is highly sought after for its advanced features and capabilities. The package or case of this chip is 900-BBGA, FCBGA, making it compact and efficient for use in various electronic devices. It was first published in 2016, which means it has been in the market for a few years and has undergone rigorous testing and improvements to ensure its quality and performance. One important aspect to consider when using this chip is its Moisture Sensitivity Level (MSL), which is rated at 4 (72 Hours). This indicates that the chip can withstand exposure to moisture for up to 72 hours without any damage, making it suitable for use in various environments. Another important parameter to note is the Peak Reflow Temperature (Cel) and Reflow Temperature-Max (s), which are not specified for this chip. This means that the chip can handle a wide range of temperatures, making it versatile and reliable for different applications. With 204 I/Os, this chip offers a high level of connectivity and can support multiple devices and peripherals. It also boasts impressive speeds of 500MHz, 600MHz, and 1.2GHz, making it ideal for demanding tasks and applications. The core processor of this chip is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2. This powerful combination of processors allows for efficient multitasking and high-speed processing. In terms of peripherals, this chip offers DMA (Direct Memory Access) and WDT (Watchdog Timer), which are essential for data transfer and system monitoring. This ensures smooth and reliable operation of the chip in various devices. Additionally, this chip is also ROHS3 compliant, meaning it meets the latest environmental standards and regulations, making it a sustainable and eco-friendly option for electronic devices. In conclusion, the Xilinx Inc. Embedded - System On Chip (SoC) chip is a top-of-the-line product that offers advanced features, high speeds, and efficient performance. Its compact size, moisture resistance, and wide temperature range make it suitable for various applications. With its powerful processors and essential peripherals, this chip is a reliable and sustainable choice for electronic devices.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU7EG-1FBVB900I System On Chip (SoC) applications.
Sensor network-on-chip (sNoC)
Industrial Pressure
Industrial automation devices
Temperature
Servo drive control module
Optical drive
Smartphone accessories
Healthcare
Functional safety for critical applications in the automotive
Communication network-on-Chip (cNoC)
XCZU7EG-1FBVB900I More Descriptions
FPGA Zynq UltraScale Family 504000 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 504K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
IC SOC CORTEX-A9 800MHZ 900FCBGA
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 504K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
IC SOC CORTEX-A9 800MHZ 900FCBGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU7EG-1FBVB900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU7EG-1FBVB900I11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-------------
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11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED360533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliantyes-----------
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-YES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant------------
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