XCZU7EG-1FBVB900I

Xilinx Inc. XCZU7EG-1FBVB900I

Part Number:
XCZU7EG-1FBVB900I
Manufacturer:
Xilinx Inc.
Ventron No:
3668955-XCZU7EG-1FBVB900I
Description:
IC FPGA 204 I/O 900FCBGA
ECAD Model:
Datasheet:
XCZU7EG-1FBVB900I

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Xilinx Inc. XCZU7EG-1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU7EG-1FBVB900I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    204
  • Speed
    500MHz, 600MHz, 1.2GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - System On Chip (SoC) chips. This particular chip, belonging to the Embedded - System On Chip (SoC) category, is highly sought after for its advanced features and capabilities. The package or case of this chip is 900-BBGA, FCBGA, making it compact and efficient for use in various electronic devices. It was first published in 2016, which means it has been in the market for a few years and has undergone rigorous testing and improvements to ensure its quality and performance. One important aspect to consider when using this chip is its Moisture Sensitivity Level (MSL), which is rated at 4 (72 Hours). This indicates that the chip can withstand exposure to moisture for up to 72 hours without any damage, making it suitable for use in various environments. Another important parameter to note is the Peak Reflow Temperature (Cel) and Reflow Temperature-Max (s), which are not specified for this chip. This means that the chip can handle a wide range of temperatures, making it versatile and reliable for different applications. With 204 I/Os, this chip offers a high level of connectivity and can support multiple devices and peripherals. It also boasts impressive speeds of 500MHz, 600MHz, and 1.2GHz, making it ideal for demanding tasks and applications. The core processor of this chip is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2. This powerful combination of processors allows for efficient multitasking and high-speed processing. In terms of peripherals, this chip offers DMA (Direct Memory Access) and WDT (Watchdog Timer), which are essential for data transfer and system monitoring. This ensures smooth and reliable operation of the chip in various devices. Additionally, this chip is also ROHS3 compliant, meaning it meets the latest environmental standards and regulations, making it a sustainable and eco-friendly option for electronic devices. In conclusion, the Xilinx Inc. Embedded - System On Chip (SoC) chip is a top-of-the-line product that offers advanced features, high speeds, and efficient performance. Its compact size, moisture resistance, and wide temperature range make it suitable for various applications. With its powerful processors and essential peripherals, this chip is a reliable and sustainable choice for electronic devices.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU7EG-1FBVB900I System On Chip (SoC) applications.

Sensor network-on-chip (sNoC)
Industrial Pressure
Industrial automation devices
Temperature
Servo drive control module
Optical drive
Smartphone accessories
Healthcare
Functional safety for critical applications in the automotive
Communication network-on-Chip (cNoC)
XCZU7EG-1FBVB900I More Descriptions
FPGA Zynq UltraScale Family 504000 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 504K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
IC SOC CORTEX-A9 800MHZ 900FCBGA
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU7EG-1FBVB900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Pbfree Code
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    View Compare
  • XCZU7EG-1FBVB900I
    XCZU7EG-1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU7CG-2FFVC1156E
    11 Weeks
    1156-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    360
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    yes
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU5EV-L1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
    YES
    900
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B900
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.