Xilinx Inc. XCZU7CG-1FFVC1156E
- Part Number:
- XCZU7CG-1FFVC1156E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3668923-XCZU7CG-1FFVC1156E
- Description:
- IC FPGA 360 I/O 1156FCBGA
- ECAD Model:
-
- Datasheet:
- XCZU7CG-1FFVC1156E
Xilinx Inc. XCZU7CG-1FFVC1156E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU7CG-1FFVC1156E.
- Factory Lead Time11 Weeks
- Package / Case1156-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O360
- Speed500MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 504K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Xilinx Inc. is the brand of this part. It is an Embedded - System On Chip (SoC) chip, which belongs to the Embedded - System On Chip (SoC) category. The package / case is 1156-BBGA, FCBGA. The operating temperature is 0°C~100°C TJ. The packaging is Tray. It was published in 2016. The series is Zynq® UltraScale ™ MPSoC CG. It has 360 I/Os. The speed can reach up to 500MHz and 1.2GHz. The RAM size is 256KB. It offers connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The architecture of this chip is MCU and FPGA.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU7CG-1FFVC1156E System On Chip (SoC) applications.
Mouse
Flow Sensors
Keyboard
Mobile market
Central alarm system
Mobile computing
AC-input BLDC motor drive
Efficient hardware for inference of neural networks
POS Terminals
Healthcare
Xilinx Inc. is the brand of this part. It is an Embedded - System On Chip (SoC) chip, which belongs to the Embedded - System On Chip (SoC) category. The package / case is 1156-BBGA, FCBGA. The operating temperature is 0°C~100°C TJ. The packaging is Tray. It was published in 2016. The series is Zynq® UltraScale ™ MPSoC CG. It has 360 I/Os. The speed can reach up to 500MHz and 1.2GHz. The RAM size is 256KB. It offers connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The architecture of this chip is MCU and FPGA.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU7CG-1FFVC1156E System On Chip (SoC) applications.
Mouse
Flow Sensors
Keyboard
Mobile market
Central alarm system
Mobile computing
AC-input BLDC motor drive
Efficient hardware for inference of neural networks
POS Terminals
Healthcare
XCZU7CG-1FFVC1156E More Descriptions
FPGA Zynq UltraScale Family 504000 Cells 20nm Technology 0.85V 1156-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 504K, C1156, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 504K, C1156, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU7CG-1FFVC1156E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusView Compare
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XCZU7CG-1FFVC1156E11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED360500MHz, 1.2GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant- -
11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
-
11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant
-
11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
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