Xilinx Inc. XCZU6EG-3FFVB1156E

Name: XCZU6EG-3FFVB1156E
Brand: Xilinx Inc.
SKU: 3828112-XCZU6EG-3FFVB1156E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU6EG-3FFVB1156E

Manufacturer:: Xilinx Inc.

Ventron No:: 3828112-XCZU6EG-3FFVB1156E

Description:: IC FPGA 328 I/O 1156FCBGA

ECAD Model:

Datasheet:: XCZU6EG-3FFVB1156E

Specifications

Xilinx Inc. XCZU6EG-3FFVB1156E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU6EG-3FFVB1156E.

Factory Lead Time
11 Weeks
Package / Case
1156-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
328
Speed
600MHz, 1.5GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 469K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The package or case of the device is 1156-BBGA, FCBGA, which refers to the type of housing used for the integrated circuit. The operating temperature range for this device is 0°C to 100°C TJ, indicating the range within which it can function properly. The device was published in 2016, suggesting that it is a relatively recent release. Its part status is active, meaning it is currently available for purchase. The peak reflow temperature and reflow temperature-max are not specified, implying that this information is not provided or may vary depending on specific conditions. The speed of the device ranges from 600MHz to 1.5GHz, indicating its processing capabilities. The core processor consists of a quad ARM Cortex-A53 MPCore with CoreSight and dual ARM Cortex-R5 with CoreSight, suggesting a powerful and versatile processing unit. The architecture of the device is a combination of MCU (Microcontroller Unit) and FPGA (Field-Programmable Gate Array), allowing for flexibility and customization. The primary attributes of this device include Zynq UltraScale FPGA with 469K logic cells, indicating its high logic capacity and suitability for complex applications.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU6EG-3FFVB1156E System On Chip (SoC) applications.

Functional safety for critical applications in the aerospace
Video Imaging
Special Issue Editors
Communication interfaces ( I2C, SPI )
POS Terminals
Industrial AC-DC
Digital Media
Mobile computing
Central alarm system
Keyboard

XCZU6EG-3FFVB1156E More Descriptions

Zynq UltraScale RFSoC, Speed Grade-3, Logic Cells 469K, B1156, RoHSXilinx SCT
FPGA Zynq UltraScale 0.85V/ 0.72V 1156-Ball BGA
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU6EG-3FFVB1156E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU6EG-3FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

328

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 469K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
XCZU7CG-2FFVC1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

360

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

yes

-

-

-

-

-

-

-

-

-

-

-

XCZU6EG-3FFVB1156E vs XCZU7CG-2FFVC1156E
XCZU5EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

-

YES

900

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B900

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU6EG-3FFVB1156E vs XCZU5EV-L1FBVB900I
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

XCZU6EG-3FFVB1156E vs XCZU7EV-1FBVB900E