Xilinx Inc. XCZU6CG-2FFVB1156E

Name: XCZU6CG-2FFVB1156E
Brand: Xilinx Inc.
SKU: 3668972-XCZU6CG-2FFVB1156E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU6CG-2FFVB1156E

Manufacturer:: Xilinx Inc.

Ventron No:: 3668972-XCZU6CG-2FFVB1156E

Description:: XCZU6CG-2FFVB1156E

ECAD Model:

Datasheet:: XCZU6CG-2FFVB1156E

Specifications

Xilinx Inc. XCZU6CG-2FFVB1156E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU6CG-2FFVB1156E.

Factory Lead Time
11 Weeks
Package / Case
1156-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Bulk
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
328
Speed
533MHz, 1.3GHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 469K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.Assigned with the package 1156-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale ? MPSoC CG series.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale ? FPGA, 469K Logic Cells.Featured in the state-of-the-art Bulk package, this SoC system on a chip provides outstanding performance.328 I/Os in total are included in this SoC part.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU6CG-2FFVB1156E System On Chip (SoC) applications.

External USB hard disk/SSD
Robotics
Healthcare
Smart appliances
Automated sorting equipment
Mobile market
Wireless sensor networks
Apple smart watch
ARM
Industrial robot

XCZU6CG-2FFVB1156E More Descriptions

FPGA Zynq UltraScale Family 469446 Cells 20nm Technology 0.85V 1156-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 469K, B1156, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
IC SOC CORTEX-A9 800MHZ 900FCBGA
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU6CG-2FFVB1156E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU6CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Bulk

2016

Zynq® UltraScale ™ MPSoC CG

yes

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

328

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 469K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-
XCZU5EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

YES

900

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B900

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU6CG-2FFVB1156E vs XCZU5EV-L1FBVB900I
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU6CG-2FFVB1156E vs XCZU9EG-1FFVC900I
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

308

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU6CG-2FFVB1156E vs XCZU19EG-1FFVD1760E