Xilinx Inc. XCZU6CG-1FFVB1156I

Name: XCZU6CG-1FFVB1156I
Brand: Xilinx Inc.
SKU: 3668949-XCZU6CG-1FFVB1156I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU6CG-1FFVB1156I

Manufacturer:: Xilinx Inc.

Ventron No:: 3668949-XCZU6CG-1FFVB1156I

Description:: XCZU6CG-1FFVB1156I

ECAD Model:

Datasheet:: XCZU6CG-1FFVB1156I

Specifications

Xilinx Inc. XCZU6CG-1FFVB1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU6CG-1FFVB1156I.

Factory Lead Time
11 Weeks
Package / Case
1156-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Bulk
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
328
Speed
500MHz, 1.2GHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 469K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Xilinx Inc. brand offers a powerful and versatile solution with their Embedded - System On Chip (SoC) chip. This chip falls under the Embedded - System On Chip (SoC) category and features a 1156-BBGA or FCBGA package/case. It is available in bulk packaging and is part of the Zynq® UltraScale ™ MPSoC CG series, which is currently in active production. The HTS code for this chip is 8542.31.00.01 and its reflow temperature-max (s) is not specified. With speeds of 500MHz and 1.2GHz, the chip's core processor is a dual ARM® Cortex®-A53 MPCore™ with CoreSight™, as well as a dual ARM® Cortex™-R5 with CoreSight™. This chip is designed for use in MCU and FPGA architectures, and its primary attributes include a Zynq® UltraScale ™ FPGA and over 469K logic cells.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU6CG-1FFVB1156I System On Chip (SoC) applications.

System-on-chip (SoC)
Functional safety for critical applications in the industrial sectors
Automated sorting equipment
Special Issue Information
Central alarm system
Embedded systems
Print Special Issue Flyer
Body control module
Industrial AC-DC
Mouse

XCZU6CG-1FFVB1156I More Descriptions

FPGA Zynq UltraScale Family 469446 Cells 20nm Technology 0.85V 1156-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 469K, B1156, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
CoC and 2-years warranty / RFQ for pricing
Product Description Demo for Development.
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU6CG-1FFVB1156I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU6CG-1FFVB1156I

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-40°C~100°C TJ

Bulk

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

328

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 469K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

180

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

YES

625

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B625

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU6CG-1FFVB1156I vs XCZU2EG-L1SFVA625I
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU6CG-1FFVB1156I vs XCZU7EV-1FBVB900E
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

464

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU6CG-1FFVB1156I vs XCZU7EV-2FFVF1517I