Xilinx Inc. XCZU5EV-L1SFVC784I
- Part Number:
- XCZU5EV-L1SFVC784I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669366-XCZU5EV-L1SFVC784I
- Description:
- IC FPGA 252 I/O 784FCBGA
- Datasheet:
- XCZU5EV-L1SFVC784I
Xilinx Inc. XCZU5EV-L1SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EV-L1SFVC784I.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EV
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations784
- Additional FeatureALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.72V
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B784
- Supply Voltage-Max (Vsup)0.742V
- Supply Voltage-Min (Vsup)0.698V
- Number of I/O252
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 256K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The Embedded - System On Chip (SoC) chip from Xilinx Inc., published in 2016, falls under the Embedded - System On Chip (SoC) category and has an HTS Code of 8542.31.00.01. It has an operating temperature range of -40°C~100°C TJ and a reflow temperature-max (s) that is not specified. The chip has a supply voltage-max (Vsup) of 0.742V and a supply voltage-min (Vsup) of 0.698V. It features a total of 252 I/Os and can operate at speeds of 500MHz, 600MHz, and 1.2GHz. With a RAM size of 256KB, the chip is powered by a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors, as well as an ARM Mali™-400 MP2.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU5EV-L1SFVC784I System On Chip (SoC) applications.
Central inverter
Temperature Sensors
Automotive gateway
POS Terminals
Transmitters
Medical Pressure
Functional safety for critical applications in the industrial sectors
Fitness
Smartphone accessories
Efficient hardware for training of neural networks
The Embedded - System On Chip (SoC) chip from Xilinx Inc., published in 2016, falls under the Embedded - System On Chip (SoC) category and has an HTS Code of 8542.31.00.01. It has an operating temperature range of -40°C~100°C TJ and a reflow temperature-max (s) that is not specified. The chip has a supply voltage-max (Vsup) of 0.742V and a supply voltage-min (Vsup) of 0.698V. It features a total of 252 I/Os and can operate at speeds of 500MHz, 600MHz, and 1.2GHz. With a RAM size of 256KB, the chip is powered by a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors, as well as an ARM Mali™-400 MP2.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU5EV-L1SFVC784I System On Chip (SoC) applications.
Central inverter
Temperature Sensors
Automotive gateway
POS Terminals
Transmitters
Medical Pressure
Functional safety for critical applications in the industrial sectors
Fitness
Smartphone accessories
Efficient hardware for training of neural networks
XCZU5EV-L1SFVC784I More Descriptions
Zynq UltraScale RFSoC, Speed Grade-L1, Logic Cells 256K, C784, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Xilinx Commercial Zynq UltraScale FPGA 256200 System Logic Cells 234240 CLB Flip-Flops 5.1Mb RAM 252 I/O Surface Mount 784-Ball FPBGA Industrial Temperature Tray
FPGA - Field Programmable Gate Array
Xilinx Commercial Zynq UltraScale FPGA 256200 System Logic Cells 234240 CLB Flip-Flops 5.1Mb RAM 252 I/O Surface Mount 784-Ball FPBGA Industrial Temperature Tray
The three parts on the right have similar specifications to XCZU5EV-L1SFVC784I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeuPs/uCs/Peripheral ICs TypeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusView Compare
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XCZU5EV-L1SFVC784I11 Weeks784-BFBGA, FCBGAYES-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)784ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B7840.742V0.698V252500MHz, 600MHz, 1.2GHz256KBMICROPROCESSOR CIRCUITQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-
-
11 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY8542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.72VNOT SPECIFIEDR-PBGA-B9000.742V0.698V204500MHz, 600MHz, 1.2GHz256KBMICROPROCESSOR CIRCUITQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant
-
11 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)--8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED---204500MHz, 600MHz, 1.2GHz256KB-Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant
-
11 Weeks1517-BBGA, FCBGA--40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)--8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED---464533MHz, 600MHz, 1.3GHz256KB-Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
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