Xilinx Inc. XCZU5EV-2SFVC784I

Name: XCZU5EV-2SFVC784I
Brand: Xilinx Inc.
SKU: 3668958-XCZU5EV-2SFVC784I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU5EV-2SFVC784I

Manufacturer:: Xilinx Inc.

Ventron No:: 3668958-XCZU5EV-2SFVC784I

Description:: IC FPGA 252 I/O 784FCBGA

ECAD Model:

Datasheet:: XCZU5EV-2SFVC784I

Specifications

Xilinx Inc. XCZU5EV-2SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EV-2SFVC784I.

Factory Lead Time
11 Weeks
Package / Case
784-BFBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EV
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
252
Speed
533MHz, 600MHz, 1.3GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 256K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The product parameters for our latest offering include an impressive operating temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments. This product was first published in 2016 and is currently active in our product line. It has a Moisture Sensitivity Level (MSL) of 4, ensuring its durability and reliability for up to 72 hours. The Peak Reflow Temperature and Reflow Temperature-Max are not specified, providing flexibility for various applications. With a speed of 533MHz, 600MHz, and 1.3GHz, this product offers high performance. It also boasts multiple connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This product is designed with an MCU or FPGA architecture and is compliant with ROHS3 standards.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU5EV-2SFVC784I System On Chip (SoC) applications.

Samsung galaxy gear
Microcontroller based SoC ( RISC-V, ARM)
PC peripherals
USB hard disk enclosure
Cyberphysical system-on-chip
Three phase UPS
ARM
Measurement testers
Mobile market
Automotive

XCZU5EV-2SFVC784I More Descriptions

FPGA Zynq UltraScale Family 256200 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 256K, C784, RoHSXilinx SCT
MCU FPGA Active ROHS3Compliant 2016 System On Chip (SOC) IC -40C~100C TJ 256KB 533MHz 600MHz 1.3GHz
Microprocessor Circuit, CMOS, PBGA784
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU5EV-2SFVC784I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

View Compare
XCZU5EV-2SFVC784I

Xilinx Inc.

11 Weeks

784-BFBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

252

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

-
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

XCZU5EV-2SFVC784I vs XCZU9EG-1FFVC900I
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

308

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

XCZU5EV-2SFVC784I vs XCZU19EG-1FFVD1760E
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

464

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

XCZU5EV-2SFVC784I vs XCZU7EV-2FFVF1517I