XCZU5EG-3SFVC784E

Xilinx Inc. XCZU5EG-3SFVC784E

Part Number:
XCZU5EG-3SFVC784E
Manufacturer:
Xilinx Inc.
Ventron No:
3828038-XCZU5EG-3SFVC784E
Description:
IC FPGA 252 I/O 784FCBGA
ECAD Model:
Datasheet:
XCZU5EG-3SFVC784E

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Specifications
Xilinx Inc. XCZU5EG-3SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EG-3SFVC784E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    784-BFBGA, FCBGA
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    252
  • Speed
    600MHz, 1.5GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The package or case for this particular product is 784-BFBGA or FCBGA, making it compact and efficient for various applications. It was first published in 2016 and is still an active part in the market. The HTS code for this product is 8542.31.00.01, indicating its classification for customs purposes. The peak reflow temperature is not specified, which could mean that it can withstand high temperatures without damage. This product has a speed range of 600MHz to 1.5GHz, making it suitable for high-performance tasks. It also has a RAM size of 256KB. The core processor is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, and a Dual ARM® Cortex™-R5 with CoreSight™, providing efficient and powerful processing capabilities. Its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it versatile and compatible with various systems. Its architecture is a combination of MCU and FPGA, making it a reliable and flexible choice for different applications.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU5EG-3SFVC784E System On Chip (SoC) applications.

Functional safety for critical applications in the industrial sectors
Cyberphysical system-on-chip
PC peripherals
CNC control
Wireless networking
Smartphones
Remote control
Smartphone accessories
Networked sensors
Published Paper
XCZU5EG-3SFVC784E More Descriptions
Zynq UltraScale RFSoC, Speed Grade-3, Logic Cells 256K, C784, RoHSXilinx SCT
FPGA Zynq UltraScale 0.85V/ 0.72V 784-Ball BGA
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU5EG-3SFVC784E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Pbfree Code
    View Compare
  • XCZU5EG-3SFVC784E
    XCZU5EG-3SFVC784E
    11 Weeks
    784-BFBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    252
    600MHz, 1.5GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
    -
  • XCZU7CG-2FFVC1156E
    11 Weeks
    1156-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    360
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    yes
  • XCZU9CG-2FFVB1156E
    11 Weeks
    1156-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    328
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    yes
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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