Xilinx Inc. XCZU5EG-3SFVC784E
- Part Number:
- XCZU5EG-3SFVC784E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3828038-XCZU5EG-3SFVC784E
- Description:
- IC FPGA 252 I/O 784FCBGA
- Datasheet:
- XCZU5EG-3SFVC784E
Xilinx Inc. XCZU5EG-3SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EG-3SFVC784E.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O252
- Speed600MHz, 1.5GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 256K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The package or case for this particular product is 784-BFBGA or FCBGA, making it compact and efficient for various applications. It was first published in 2016 and is still an active part in the market. The HTS code for this product is 8542.31.00.01, indicating its classification for customs purposes. The peak reflow temperature is not specified, which could mean that it can withstand high temperatures without damage. This product has a speed range of 600MHz to 1.5GHz, making it suitable for high-performance tasks. It also has a RAM size of 256KB. The core processor is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, and a Dual ARM® Cortex™-R5 with CoreSight™, providing efficient and powerful processing capabilities. Its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it versatile and compatible with various systems. Its architecture is a combination of MCU and FPGA, making it a reliable and flexible choice for different applications.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EG-3SFVC784E System On Chip (SoC) applications.
Functional safety for critical applications in the industrial sectors
Cyberphysical system-on-chip
PC peripherals
CNC control
Wireless networking
Smartphones
Remote control
Smartphone accessories
Networked sensors
Published Paper
The package or case for this particular product is 784-BFBGA or FCBGA, making it compact and efficient for various applications. It was first published in 2016 and is still an active part in the market. The HTS code for this product is 8542.31.00.01, indicating its classification for customs purposes. The peak reflow temperature is not specified, which could mean that it can withstand high temperatures without damage. This product has a speed range of 600MHz to 1.5GHz, making it suitable for high-performance tasks. It also has a RAM size of 256KB. The core processor is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, and a Dual ARM® Cortex™-R5 with CoreSight™, providing efficient and powerful processing capabilities. Its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it versatile and compatible with various systems. Its architecture is a combination of MCU and FPGA, making it a reliable and flexible choice for different applications.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EG-3SFVC784E System On Chip (SoC) applications.
Functional safety for critical applications in the industrial sectors
Cyberphysical system-on-chip
PC peripherals
CNC control
Wireless networking
Smartphones
Remote control
Smartphone accessories
Networked sensors
Published Paper
XCZU5EG-3SFVC784E More Descriptions
Zynq UltraScale RFSoC, Speed Grade-3, Logic Cells 256K, C784, RoHSXilinx SCT
FPGA Zynq UltraScale 0.85V/ 0.72V 784-Ball BGA
FPGA - Field Programmable Gate Array
FPGA Zynq UltraScale 0.85V/ 0.72V 784-Ball BGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU5EG-3SFVC784E.
-
ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeView Compare
-
XCZU5EG-3SFVC784E11 Weeks784-BFBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED252600MHz, 1.5GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant--
-
11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED360533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliantyes
-
11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes
-
11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
10 April 2024
LM2904DT Dual Operational Amplifier: Features, Package and Specifications
Ⅰ. Overview of LM2904DTⅡ. Electrical characteristic curvesⅢ. Features of LM2904DTⅣ. Package of LM2904DTⅤ. Supply voltage and current requirements of LM2904DTⅥ. Specifications of LM2904DTⅦ. How to use LM2904DT in... -
10 April 2024
STM32F103CBT6 Microcontroller Features, Application and STM32F103CBT6 vs CKS32F103C8T6
Ⅰ. Description of STM32F103CBT6Ⅱ. Low-power modes of STM32F103CBT6Ⅲ. Functional features of STM32F103CBT6Ⅳ. Application fields of STM32F103CBT6Ⅴ. GPIO attributes and configuration process of STM32F103CBT6Ⅵ. How to program and debug... -
11 April 2024
A Complete Guide to IR2104 Half-Bridge Driver
Ⅰ. IR2104 descriptionⅡ. IR2104 half-bridge driver circuit characteristicsⅢ. IR2104 half-bridge driver working principleⅣ. Practical application of IR2104Ⅴ. Recommended operating conditions of IR2104Ⅵ. What are the heat dissipation measures... -
11 April 2024
74LS138 Decoder Working Principle, Application Scenarios and 7AHC138 vs 74LS138
Ⅰ. Introduction to 74LS138Ⅱ. What is the meaning of the 74LS138 naming?Ⅲ. Working principle of 74LS138Ⅳ. Example of application circuit diagram of 74LS138Ⅴ. Application scenarios of 74LS138 decoderⅥ....
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.