Xilinx Inc. XCZU5EG-2FBVB900I
- Part Number:
- XCZU5EG-2FBVB900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3668971-XCZU5EG-2FBVB900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU5EG-2FBVB900I
Xilinx Inc. XCZU5EG-2FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EG-2FBVB900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed533MHz, 600MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 256K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The Xilinx Inc. brand offers a highly versatile and powerful Embedded - System On Chip (SoC) chip, belonging to the Embedded - System On Chip (SoC) category. This chip has an impressive operating temperature range of -40°C to 100°C TJ and comes packaged in a convenient tray format. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours) and an HTS Code of 8542.31.00.01, this chip is designed to withstand various environmental conditions. Its Reflow Temperature-Max (s) is NOT SPECIFIED, making it suitable for a wide range of applications. The chip also boasts a RAM Size of 256KB and is equipped with a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 Core Processor. Its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This chip is designed for use in MCU and FPGA architectures and its primary attributes include the Zynq®UltraScale ™ FPGA and 256K Logic Cells.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EG-2FBVB900I System On Chip (SoC) applications.
ARM support modules
Remote control
Flow Sensors
Samsung galaxy gear
Communication interfaces ( I2C, SPI )
Efficient hardware for inference of neural networks
Avionics
Deep learning hardware
PC peripherals
Multiprocessor system-on-chips (MPSoCs)
The Xilinx Inc. brand offers a highly versatile and powerful Embedded - System On Chip (SoC) chip, belonging to the Embedded - System On Chip (SoC) category. This chip has an impressive operating temperature range of -40°C to 100°C TJ and comes packaged in a convenient tray format. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours) and an HTS Code of 8542.31.00.01, this chip is designed to withstand various environmental conditions. Its Reflow Temperature-Max (s) is NOT SPECIFIED, making it suitable for a wide range of applications. The chip also boasts a RAM Size of 256KB and is equipped with a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 Core Processor. Its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This chip is designed for use in MCU and FPGA architectures and its primary attributes include the Zynq®UltraScale ™ FPGA and 256K Logic Cells.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EG-2FBVB900I System On Chip (SoC) applications.
ARM support modules
Remote control
Flow Sensors
Samsung galaxy gear
Communication interfaces ( I2C, SPI )
Efficient hardware for inference of neural networks
Avionics
Deep learning hardware
PC peripherals
Multiprocessor system-on-chips (MPSoCs)
XCZU5EG-2FBVB900I More Descriptions
FPGA Zynq UltraScale Family 256200 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 256K, B900, RoHSXilinx SCT
Dual 2-line to 4-line decoders / demultiplexers 16-SO 0 to 70
IC SOC CORTEX-A9 667MHZ 900FCBGA
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 256K, B900, RoHSXilinx SCT
Dual 2-line to 4-line decoders / demultiplexers 16-SO 0 to 70
IC SOC CORTEX-A9 667MHZ 900FCBGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU5EG-2FBVB900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU5EG-2FBVB900I11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-------------
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11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes-----------
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-YES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 Compliant-YES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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