Xilinx Inc. XCZU5EG-1SFVC784I
- Part Number:
- XCZU5EG-1SFVC784I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669389-XCZU5EG-1SFVC784I
- Description:
- IC FPGA 252 I/O 784FCBGA
- Datasheet:
- XCZU5EG-1SFVC784I
Xilinx Inc. XCZU5EG-1SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EG-1SFVC784I.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O252
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 256K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case for this particular product is 784-BFBGA, FCBGA, which indicates the type of physical housing for the integrated circuit. The operating temperature range for this product is -40°C to 100°C TJ, meaning it can function within this temperature range without any issues. The packaging format for this product is a tray, which is the method used to transport and store the individual components. This particular product belongs to the Zynq® UltraScale ™ MPSoC EG series, indicating its classification within a family of similar devices. The part status is active, meaning it is currently in production and available for purchase. The speed of this product can operate at three different frequencies, namely 500MHz, 600MHz, and 1.2GHz. The peripherals included in this product are DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality. The architecture of this product combines both MCU (Microcontroller Unit) and FPGA (Field-Programmable Gate Array) technologies, allowing for a versatile and customizable solution. Its primary attributes include a Zynq® UltraScale ™ FPGA with 256K logic cells, indicating its high-performance capabilities. Lastly, this product is ROHS3 compliant, meaning it adheres to the European Union's Restriction of Hazardous Substances directive.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EG-1SFVC784I System On Chip (SoC) applications.
Functional safety for critical applications in the aerospace
Measurement tools
Robotics
RISC-V
Industrial automation devices
Mobile market
Deep learning hardware
Central inverter
Networked Media Encode/Decode
AC-input BLDC motor drive
The package or case for this particular product is 784-BFBGA, FCBGA, which indicates the type of physical housing for the integrated circuit. The operating temperature range for this product is -40°C to 100°C TJ, meaning it can function within this temperature range without any issues. The packaging format for this product is a tray, which is the method used to transport and store the individual components. This particular product belongs to the Zynq® UltraScale ™ MPSoC EG series, indicating its classification within a family of similar devices. The part status is active, meaning it is currently in production and available for purchase. The speed of this product can operate at three different frequencies, namely 500MHz, 600MHz, and 1.2GHz. The peripherals included in this product are DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality. The architecture of this product combines both MCU (Microcontroller Unit) and FPGA (Field-Programmable Gate Array) technologies, allowing for a versatile and customizable solution. Its primary attributes include a Zynq® UltraScale ™ FPGA with 256K logic cells, indicating its high-performance capabilities. Lastly, this product is ROHS3 compliant, meaning it adheres to the European Union's Restriction of Hazardous Substances directive.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5EG-1SFVC784I System On Chip (SoC) applications.
Functional safety for critical applications in the aerospace
Measurement tools
Robotics
RISC-V
Industrial automation devices
Mobile market
Deep learning hardware
Central inverter
Networked Media Encode/Decode
AC-input BLDC motor drive
XCZU5EG-1SFVC784I More Descriptions
FPGA Zynq UltraScale 256200 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 256K, C784, RoHSXilinx SCT
MCU FPGA Active ROHS3Compliant 2016 System On Chip (SOC) IC -40C~100C TJ 256KB 500MHz 600MHz 1.2GHz
Trimmer / Variable Capacitors 4.5 - 20PF 100V N750
Programmable SoC, CMOS, PBGA784
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 256K, C784, RoHSXilinx SCT
MCU FPGA Active ROHS3Compliant 2016 System On Chip (SOC) IC -40C~100C TJ 256KB 500MHz 600MHz 1.2GHz
Trimmer / Variable Capacitors 4.5 - 20PF 100V N750
Programmable SoC, CMOS, PBGA784
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU5EG-1SFVC784I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU5EG-1SFVC784I11 Weeks784-BFBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED252500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant------------
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11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
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