XCZU5EG-1SFVC784I

Xilinx Inc. XCZU5EG-1SFVC784I

Part Number:
XCZU5EG-1SFVC784I
Manufacturer:
Xilinx Inc.
Ventron No:
3669389-XCZU5EG-1SFVC784I
Description:
IC FPGA 252 I/O 784FCBGA
ECAD Model:
Datasheet:
XCZU5EG-1SFVC784I

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Specifications
Xilinx Inc. XCZU5EG-1SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5EG-1SFVC784I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    784-BFBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    252
  • Speed
    500MHz, 600MHz, 1.2GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case for this particular product is 784-BFBGA, FCBGA, which indicates the type of physical housing for the integrated circuit. The operating temperature range for this product is -40°C to 100°C TJ, meaning it can function within this temperature range without any issues. The packaging format for this product is a tray, which is the method used to transport and store the individual components. This particular product belongs to the Zynq® UltraScale ™ MPSoC EG series, indicating its classification within a family of similar devices. The part status is active, meaning it is currently in production and available for purchase. The speed of this product can operate at three different frequencies, namely 500MHz, 600MHz, and 1.2GHz. The peripherals included in this product are DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality. The architecture of this product combines both MCU (Microcontroller Unit) and FPGA (Field-Programmable Gate Array) technologies, allowing for a versatile and customizable solution. Its primary attributes include a Zynq® UltraScale ™ FPGA with 256K logic cells, indicating its high-performance capabilities. Lastly, this product is ROHS3 compliant, meaning it adheres to the European Union's Restriction of Hazardous Substances directive.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU5EG-1SFVC784I System On Chip (SoC) applications.

Functional safety for critical applications in the aerospace
Measurement tools
Robotics
RISC-V
Industrial automation devices
Mobile market
Deep learning hardware
Central inverter
Networked Media Encode/Decode
AC-input BLDC motor drive
XCZU5EG-1SFVC784I More Descriptions
FPGA Zynq UltraScale 256200 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 256K, C784, RoHSXilinx SCT
MCU FPGA Active ROHS3Compliant 2016 System On Chip (SOC) IC -40C~100C TJ 256KB 500MHz 600MHz 1.2GHz
Trimmer / Variable Capacitors 4.5 - 20PF 100V N750
Programmable SoC, CMOS, PBGA784
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU5EG-1SFVC784I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    View Compare
  • XCZU5EG-1SFVC784I
    XCZU5EG-1SFVC784I
    11 Weeks
    784-BFBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    252
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    -40°C~100°C TJ
    Tray
    -
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    YES
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B625
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
  • XCZU7EV-1FBVB900E
    11 Weeks
    900-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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