Xilinx Inc. XCZU5CG-2SFVC784E
- Part Number:
- XCZU5CG-2SFVC784E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3828192-XCZU5CG-2SFVC784E
- Description:
- IC FPGA 252 I/O 784FCBGA
- ECAD Model:
-
- Datasheet:
- XCZU5CG-2SFVC784E
Xilinx Inc. XCZU5CG-2SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5CG-2SFVC784E.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O252
- Speed533MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 256K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Xilinx Inc. brand is well-known in the industry for producing high-quality Embedded - System On Chip (SoC) chips. This particular chip belongs to the Embedded - System On Chip (SoC) category, making it a versatile and powerful component for various applications. The package/case of this chip is 784-BFBGA, FCBGA, providing a compact yet efficient design. It was published in 2016, showcasing its modern and up-to-date technology. As part of the Zynq® UltraScale ™ MPSoC CG series, this chip offers advanced features and capabilities. It is also Pbfree Code compliant, ensuring its environmental friendliness. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), this chip can withstand moderate levels of moisture exposure. Its HTS Code is 8542.31.00.01, indicating its classification for international trade purposes. The Peak Reflow Temperature (Cel) for this chip is not specified, meaning it can be used in a wide range of temperature conditions. With a total of 252 I/Os, it provides ample connectivity options. The core processor of this chip consists of Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™, ensuring efficient and powerful processing capabilities. Additionally, this chip is ROHS3 Compliant, meeting the latest environmental standards. Overall, the Xilinx Inc. Embedded - System On Chip (SoC) chip offers a comprehensive set of features and parameters, making it a top choice for various embedded system applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5CG-2SFVC784E System On Chip (SoC) applications.
Special Issue Editors
Vending machines
Sensor network-on-chip (sNoC)
String inverter
Automotive
Remote control
Communication interfaces ( I2C, SPI )
Wireless networking
Optical drive
Smartphone accessories
The Xilinx Inc. brand is well-known in the industry for producing high-quality Embedded - System On Chip (SoC) chips. This particular chip belongs to the Embedded - System On Chip (SoC) category, making it a versatile and powerful component for various applications. The package/case of this chip is 784-BFBGA, FCBGA, providing a compact yet efficient design. It was published in 2016, showcasing its modern and up-to-date technology. As part of the Zynq® UltraScale ™ MPSoC CG series, this chip offers advanced features and capabilities. It is also Pbfree Code compliant, ensuring its environmental friendliness. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), this chip can withstand moderate levels of moisture exposure. Its HTS Code is 8542.31.00.01, indicating its classification for international trade purposes. The Peak Reflow Temperature (Cel) for this chip is not specified, meaning it can be used in a wide range of temperature conditions. With a total of 252 I/Os, it provides ample connectivity options. The core processor of this chip consists of Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™, ensuring efficient and powerful processing capabilities. Additionally, this chip is ROHS3 Compliant, meeting the latest environmental standards. Overall, the Xilinx Inc. Embedded - System On Chip (SoC) chip offers a comprehensive set of features and parameters, making it a top choice for various embedded system applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5CG-2SFVC784E System On Chip (SoC) applications.
Special Issue Editors
Vending machines
Sensor network-on-chip (sNoC)
String inverter
Automotive
Remote control
Communication interfaces ( I2C, SPI )
Wireless networking
Optical drive
Smartphone accessories
XCZU5CG-2SFVC784E More Descriptions
FPGA Zynq UltraScale 256200 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 256K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 256K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU5CG-2SFVC784E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPbfree CodePart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU5CG-2SFVC784E11 Weeks784-BFBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGyesActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED252533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant------------ -
11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EV-Active4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 CompliantYES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EV-Active4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
-
11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EG-Active4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant-----------
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