Xilinx Inc. XCZU5CG-1FBVB900I
- Part Number:
- XCZU5CG-1FBVB900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669361-XCZU5CG-1FBVB900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU5CG-1FBVB900I
Xilinx Inc. XCZU5CG-1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5CG-1FBVB900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed500MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 256K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Xilinx Inc. brand is a well-known and reputable brand in the technology industry. Their products are highly regarded for their quality and reliability. One of their latest offerings is an Embedded - System On Chip (SoC) chip, which falls under the Embedded - System On Chip (SoC) category. This chip is designed to be compact and efficient, making it perfect for use in various electronic devices. The package/case of this chip is 900-BBGA, FCBGA, which is a small and compact form factor that allows for easy integration into different devices. This chip was first introduced in 2016 and has been continuously improved upon since then. It is part of the Zynq® UltraScale ™ MPSoC CG series, which is known for its high performance and advanced features. This chip is currently in an active production status, making it readily available for purchase. It has a Moisture Sensitivity Level (MSL) of 4 (72 Hours), which means it can withstand exposure to moisture for up to 72 hours without any negative effects. The HTS Code for this chip is 8542.31.00.01, which is a classification code used for international trade. The reflow temperature-max (s) for this chip is not specified, as it can vary depending on the specific application and usage. This chip has a total of 204 I/O (input/output) pins, allowing for versatile connectivity options. The core processor of this chip is a powerful Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, which enables it to handle complex tasks and processes with ease. Additionally, this chip comes with various peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality and performance. Overall, the Xilinx Inc. chip is a highly advanced and versatile product that offers top-notch performance and features, making it a popular choice among electronic device manufacturers.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5CG-1FBVB900I System On Chip (SoC) applications.
Keywords
Digital Signal Processing
Remote control
Avionics
Industrial sectors
PC peripherals
Industrial robot
Digital Media
RISC-V
Flow Sensors
The Xilinx Inc. brand is a well-known and reputable brand in the technology industry. Their products are highly regarded for their quality and reliability. One of their latest offerings is an Embedded - System On Chip (SoC) chip, which falls under the Embedded - System On Chip (SoC) category. This chip is designed to be compact and efficient, making it perfect for use in various electronic devices. The package/case of this chip is 900-BBGA, FCBGA, which is a small and compact form factor that allows for easy integration into different devices. This chip was first introduced in 2016 and has been continuously improved upon since then. It is part of the Zynq® UltraScale ™ MPSoC CG series, which is known for its high performance and advanced features. This chip is currently in an active production status, making it readily available for purchase. It has a Moisture Sensitivity Level (MSL) of 4 (72 Hours), which means it can withstand exposure to moisture for up to 72 hours without any negative effects. The HTS Code for this chip is 8542.31.00.01, which is a classification code used for international trade. The reflow temperature-max (s) for this chip is not specified, as it can vary depending on the specific application and usage. This chip has a total of 204 I/O (input/output) pins, allowing for versatile connectivity options. The core processor of this chip is a powerful Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, which enables it to handle complex tasks and processes with ease. Additionally, this chip comes with various peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality and performance. Overall, the Xilinx Inc. chip is a highly advanced and versatile product that offers top-notch performance and features, making it a popular choice among electronic device manufacturers.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU5CG-1FBVB900I System On Chip (SoC) applications.
Keywords
Digital Signal Processing
Remote control
Avionics
Industrial sectors
PC peripherals
Industrial robot
Digital Media
RISC-V
Flow Sensors
XCZU5CG-1FBVB900I More Descriptions
FPGA Zynq UltraScale Family 256200 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 256K, B900, RoHSXilinx SCT
IC FPGA SOC ZUEV LP Q100 784SBGA
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 256K, B900, RoHSXilinx SCT
IC FPGA SOC ZUEV LP Q100 784SBGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU5CG-1FBVB900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU5CG-1FBVB900I11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 1.2GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant------------
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11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-----------
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
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