XCZU5CG-1FBVB900I

Xilinx Inc. XCZU5CG-1FBVB900I

Part Number:
XCZU5CG-1FBVB900I
Manufacturer:
Xilinx Inc.
Ventron No:
3669361-XCZU5CG-1FBVB900I
Description:
IC FPGA 204 I/O 900FCBGA
ECAD Model:
Datasheet:
XCZU5CG-1FBVB900I

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Specifications
Xilinx Inc. XCZU5CG-1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU5CG-1FBVB900I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    204
  • Speed
    500MHz, 1.2GHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Xilinx Inc. brand is a well-known and reputable brand in the technology industry. Their products are highly regarded for their quality and reliability. One of their latest offerings is an Embedded - System On Chip (SoC) chip, which falls under the Embedded - System On Chip (SoC) category. This chip is designed to be compact and efficient, making it perfect for use in various electronic devices. The package/case of this chip is 900-BBGA, FCBGA, which is a small and compact form factor that allows for easy integration into different devices. This chip was first introduced in 2016 and has been continuously improved upon since then. It is part of the Zynq® UltraScale ™ MPSoC CG series, which is known for its high performance and advanced features. This chip is currently in an active production status, making it readily available for purchase. It has a Moisture Sensitivity Level (MSL) of 4 (72 Hours), which means it can withstand exposure to moisture for up to 72 hours without any negative effects. The HTS Code for this chip is 8542.31.00.01, which is a classification code used for international trade. The reflow temperature-max (s) for this chip is not specified, as it can vary depending on the specific application and usage. This chip has a total of 204 I/O (input/output) pins, allowing for versatile connectivity options. The core processor of this chip is a powerful Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, which enables it to handle complex tasks and processes with ease. Additionally, this chip comes with various peripherals such as DMA (Direct Memory Access) and WDT (Watchdog Timer), which enhance its functionality and performance. Overall, the Xilinx Inc. chip is a highly advanced and versatile product that offers top-notch performance and features, making it a popular choice among electronic device manufacturers.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU5CG-1FBVB900I System On Chip (SoC) applications.

Keywords
Digital Signal Processing
Remote control
Avionics
Industrial sectors
PC peripherals
Industrial robot
Digital Media
RISC-V
Flow Sensors
XCZU5CG-1FBVB900I More Descriptions
FPGA Zynq UltraScale Family 256200 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 256K, B900, RoHSXilinx SCT
IC FPGA SOC ZUEV LP Q100 784SBGA
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU5CG-1FBVB900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    View Compare
  • XCZU5CG-1FBVB900I
    XCZU5CG-1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 1.2GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    -40°C~100°C TJ
    Tray
    -
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    YES
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B625
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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