XCZU4EV-L2SFVC784E

Xilinx Inc. XCZU4EV-L2SFVC784E

Part Number:
XCZU4EV-L2SFVC784E
Manufacturer:
Xilinx Inc.
Ventron No:
3669343-XCZU4EV-L2SFVC784E
Description:
IC FPGA 252 I/O 784FCBGA
ECAD Model:
Datasheet:
XCZU4EV-L2SFVC784E

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Specifications
Xilinx Inc. XCZU4EV-L2SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EV-L2SFVC784E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    784-BFBGA, FCBGA
  • Supplier Device Package
    784-FCBGA (23x23)
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC EV
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of I/O
    252
  • Speed
    533MHz, 600MHz, 1.3GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 192K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The manufacturer of this particular component is Xilinx Inc., a company specializing in embedded systems. This particular chip is an Embedded - System On Chip (SoC) and falls under the same category. It comes in a 784-FCBGA (23x23) package and has an operating temperature range of 0°C to 100°C TJ. The packaging for this chip is in a tray form. It is part of the Zynq® UltraScale ™ MPSoC EV series and is currently in active production. The Moisture Sensitivity Level (MSL) for this chip is 4, meaning it can withstand exposure to moisture for up to 72 hours. It has a total of 252 I/O (input/output) connections and a RAM size of 256KB. This chip also offers various connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. It is also compliant with the Restriction of Hazardous Substances Directive (RoHS) and is considered to be RoHS3 compliant.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU4EV-L2SFVC784E System On Chip (SoC) applications.

DC-input BLDC motor drive
Communication network-on-Chip (cNoC)
Mobile market
Automated sorting equipment
Industrial automation devices
Microcontroller
AC-input BLDC motor drive
Measurement testers
Central alarm system
Remote control
XCZU4EV-L2SFVC784E More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.9V 784-Pin FC-BGA Tray
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 192K, C784, RoHSXilinx SCT
MPSOC, ARM CORTEX-A53/R5, FCBGA-784
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-784; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:784Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-L2SFVC784E
Product Comparison
The three parts on the right have similar specifications to XCZU4EV-L2SFVC784E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Pbfree Code
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    View Compare
  • XCZU4EV-L2SFVC784E
    XCZU4EV-L2SFVC784E
    11 Weeks
    784-BFBGA, FCBGA
    784-FCBGA (23x23)
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    252
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 192K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU9CG-2FFVB1156E
    11 Weeks
    1156-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    328
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    yes
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU5EV-L1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    YES
    900
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B900
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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