Xilinx Inc. XCZU4EV-L2SFVC784E
- Part Number:
- XCZU4EV-L2SFVC784E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669343-XCZU4EV-L2SFVC784E
- Description:
- IC FPGA 252 I/O 784FCBGA
- Datasheet:
- XCZU4EV-L2SFVC784E
Xilinx Inc. XCZU4EV-L2SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EV-L2SFVC784E.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Supplier Device Package784-FCBGA (23x23)
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EV
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of I/O252
- Speed533MHz, 600MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 192K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The manufacturer of this particular component is Xilinx Inc., a company specializing in embedded systems. This particular chip is an Embedded - System On Chip (SoC) and falls under the same category. It comes in a 784-FCBGA (23x23) package and has an operating temperature range of 0°C to 100°C TJ. The packaging for this chip is in a tray form. It is part of the Zynq® UltraScale ™ MPSoC EV series and is currently in active production. The Moisture Sensitivity Level (MSL) for this chip is 4, meaning it can withstand exposure to moisture for up to 72 hours. It has a total of 252 I/O (input/output) connections and a RAM size of 256KB. This chip also offers various connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. It is also compliant with the Restriction of Hazardous Substances Directive (RoHS) and is considered to be RoHS3 compliant.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EV-L2SFVC784E System On Chip (SoC) applications.
DC-input BLDC motor drive
Communication network-on-Chip (cNoC)
Mobile market
Automated sorting equipment
Industrial automation devices
Microcontroller
AC-input BLDC motor drive
Measurement testers
Central alarm system
Remote control
The manufacturer of this particular component is Xilinx Inc., a company specializing in embedded systems. This particular chip is an Embedded - System On Chip (SoC) and falls under the same category. It comes in a 784-FCBGA (23x23) package and has an operating temperature range of 0°C to 100°C TJ. The packaging for this chip is in a tray form. It is part of the Zynq® UltraScale ™ MPSoC EV series and is currently in active production. The Moisture Sensitivity Level (MSL) for this chip is 4, meaning it can withstand exposure to moisture for up to 72 hours. It has a total of 252 I/O (input/output) connections and a RAM size of 256KB. This chip also offers various connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. It is also compliant with the Restriction of Hazardous Substances Directive (RoHS) and is considered to be RoHS3 compliant.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EV-L2SFVC784E System On Chip (SoC) applications.
DC-input BLDC motor drive
Communication network-on-Chip (cNoC)
Mobile market
Automated sorting equipment
Industrial automation devices
Microcontroller
AC-input BLDC motor drive
Measurement testers
Central alarm system
Remote control
XCZU4EV-L2SFVC784E More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.9V 784-Pin FC-BGA Tray
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 192K, C784, RoHSXilinx SCT
MPSOC, ARM CORTEX-A53/R5, FCBGA-784
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-784; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:784Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-L2SFVC784E
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 192K, C784, RoHSXilinx SCT
MPSOC, ARM CORTEX-A53/R5, FCBGA-784
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-784; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:784Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-L2SFVC784E
The three parts on the right have similar specifications to XCZU4EV-L2SFVC784E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeHTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Surface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU4EV-L2SFVC784E11 Weeks784-BFBGA, FCBGA784-FCBGA (23x23)0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)252533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 192K Logic CellsROHS3 Compliant----------------
-
11 Weeks1156-BBGA, FCBGA-0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes8542.31.00.01NOT SPECIFIEDNOT SPECIFIED-----------
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11 Weeks900-BBGA, FCBGA--40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-8542.31.00.01NOT SPECIFIEDNOT SPECIFIEDYES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks1760-BBGA, FCBGA-0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-8542.31.00.01NOT SPECIFIEDNOT SPECIFIED-----------
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