Xilinx Inc. XCZU4EV-L1FBVB900I

Name: XCZU4EV-L1FBVB900I
Brand: Xilinx Inc.
SKU: 3669386-XCZU4EV-L1FBVB900I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU4EV-L1FBVB900I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669386-XCZU4EV-L1FBVB900I

Description:: IC FPGA 204 I/O 900FCBGA

ECAD Model:

Datasheet:: XCZU4EV-L1FBVB900I

Specifications

Xilinx Inc. XCZU4EV-L1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EV-L1FBVB900I.

Factory Lead Time
11 Weeks
Package / Case
900-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EV
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.72V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B900
Supply Voltage-Max (Vsup)
0.742V
Supply Voltage-Min (Vsup)
0.698V
Number of I/O
204
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 192K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The Xilinx Inc. brand offers a powerful Embedded - System On Chip (SoC) chip within theEmbedded - System On Chip (SoC) category. This chip, part of the Zynq® UltraScale ™ MPSoC EV series, was published in 2016 and features a 900-BBGA, FCBGA package with surface mount capability. In addition, it is also available with 0.85V nominal supply and operates on CMOS technology. With a maximum supply voltage of 0.742V and a minimum of 0.698V, this chip is suitable for a variety of applications. Its architecture combines both MCU and FPGA capabilities, making it a versatile choice for various projects. Furthermore, it is compliant with ROHS3 regulations.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU4EV-L1FBVB900I System On Chip (SoC) applications.

CNC control
Measurement tools
Automotive gateway
Body control module
Defense
Measurement testers
Print Special Issue Flyer
ARM Cortex M4 microcontroller
Efficient hardware for training of neural networks
Healthcare

XCZU4EV-L1FBVB900I More Descriptions

FPGA XCZU4EV Family 192150 Logic Units 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA
Zynq UltraScale RFSoC, Speed Grade-L1, Logic Cells 192K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
MPSOC, ARM CORTEX-A53/R5, FCBGA-900
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-900; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-L1FBVB900I

Product Comparison

The three parts on the right have similar specifications to XCZU4EV-L1FBVB900I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

View Compare
XCZU4EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

900

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.72V

NOT SPECIFIED

R-PBGA-B900

0.742V

0.698V

204

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 192K Logic Cells

ROHS3 Compliant

-

-
XCZU7CG-2FFVC1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

360

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

yes

XCZU4EV-L1FBVB900I vs XCZU7CG-2FFVC1156E
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

328

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

yes

XCZU4EV-L1FBVB900I vs XCZU9CG-2FFVB1156E
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

308

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

-

XCZU4EV-L1FBVB900I vs XCZU19EG-1FFVD1760E