Xilinx Inc. XCZU4EV-3SFVC784E
- Part Number:
- XCZU4EV-3SFVC784E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669338-XCZU4EV-3SFVC784E
- Description:
- IC FPGA 252 I/O 784FCBGA
- Datasheet:
- XCZU4EV-3SFVC784E
Xilinx Inc. XCZU4EV-3SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EV-3SFVC784E.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EV
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O252
- Speed600MHz, 1.5GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 192K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The packaging for this particular product is a tray, and it falls under the Zynq® UltraScale ™ MPSoC EV series. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand up to 72 hours of exposure to moisture. The Peak Reflow Temperature (Cel) and Reflow Temperature-Max (s) are not specified. This device has a total of 252 I/Os, and a RAM size of 256KB. The core processor is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, as well as a Dual ARM® Cortex™-R5 with CoreSight™. Some of its peripherals include DMA and WDT, and it also has connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EV-3SFVC784E System On Chip (SoC) applications.
Robotics
Vending machines
Deep learning hardware
Mobile market
Video Imaging
Published Paper
Microprocessors
Keyboard
Industrial robot
ARM processors
The packaging for this particular product is a tray, and it falls under the Zynq® UltraScale ™ MPSoC EV series. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand up to 72 hours of exposure to moisture. The Peak Reflow Temperature (Cel) and Reflow Temperature-Max (s) are not specified. This device has a total of 252 I/Os, and a RAM size of 256KB. The core processor is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, as well as a Dual ARM® Cortex™-R5 with CoreSight™. Some of its peripherals include DMA and WDT, and it also has connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EV-3SFVC784E System On Chip (SoC) applications.
Robotics
Vending machines
Deep learning hardware
Mobile market
Video Imaging
Published Paper
Microprocessors
Keyboard
Industrial robot
ARM processors
XCZU4EV-3SFVC784E More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.9V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-3, Logic Cells 192K, C784, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-3, Logic Cells 192K, C784, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU4EV-3SFVC784E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU4EV-3SFVC784E11 Weeks784-BFBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED252600MHz, 1.5GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 192K Logic CellsROHS3 Compliant------------
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 CompliantYES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant-----------
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