Xilinx Inc. XCZU4EV-2FBVB900I
- Part Number:
- XCZU4EV-2FBVB900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669377-XCZU4EV-2FBVB900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU4EV-2FBVB900I
Xilinx Inc. XCZU4EV-2FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EV-2FBVB900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EV
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed533MHz, 600MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 192K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The 900-BBGA and FCBGA package/case of the Zynq® UltraScale ™ MPSoC EV was published in 2016 and is part of the Zynq® UltraScale ™ MPSoC EV series. It has a moisture sensitivity level (MSL) of 4, meaning it can withstand 72 hours of exposure to moisture. Its HTS code is 8542.31.00.01 and it has a total of 204 I/O. The speed options for this product are 533MHz, 600MHz, and 1.3GHz. It also features peripherals such as DMA and WDT, and is ROHS3 compliant.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EV-2FBVB900I System On Chip (SoC) applications.
String inverter
Deep learning hardware
Smart appliances
External USB hard disk/SSD
Automotive gateway
Servo drive control module
Communication interfaces ( I2C, SPI )
sequence controllers
Sensor network-on-chip (sNoC)
AC drive control module
The 900-BBGA and FCBGA package/case of the Zynq® UltraScale ™ MPSoC EV was published in 2016 and is part of the Zynq® UltraScale ™ MPSoC EV series. It has a moisture sensitivity level (MSL) of 4, meaning it can withstand 72 hours of exposure to moisture. Its HTS code is 8542.31.00.01 and it has a total of 204 I/O. The speed options for this product are 533MHz, 600MHz, and 1.3GHz. It also features peripherals such as DMA and WDT, and is ROHS3 compliant.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EV-2FBVB900I System On Chip (SoC) applications.
String inverter
Deep learning hardware
Smart appliances
External USB hard disk/SSD
Automotive gateway
Servo drive control module
Communication interfaces ( I2C, SPI )
sequence controllers
Sensor network-on-chip (sNoC)
AC drive control module
XCZU4EV-2FBVB900I More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 192K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
MPSOC, ARM CORTEX-A53/R5, FCBGA-900
IC REG LINEAR 2.5V 150MA SOT23-5
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-900; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-2FBVB900I
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 192K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
MPSOC, ARM CORTEX-A53/R5, FCBGA-900
IC REG LINEAR 2.5V 150MA SOT23-5
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-900; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-2FBVB900I
The three parts on the right have similar specifications to XCZU4EV-2FBVB900I.
-
ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
-
XCZU4EV-2FBVB900I11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 192K Logic CellsROHS3 Compliant------------
-
11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
-
11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
-
11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
16 October 2023
What Is H1102N Pulse Ethernet Transformer?
Ⅰ. What is a transformer?Ⅱ. Overview of H1102NLⅢ. Pin configuration, symbol and footprint of H1102NLⅣ. Technical parameters of H1102NLⅤ. Features of H1102NLⅥ. Working principle of H1102NLⅦ. Dimensions and... -
16 October 2023
BD139 Transistor Equivalent, Technical Parameters and Applications
Ⅰ. Overview of BD139Ⅱ. BD139 symbol, footprint and pin configurationⅢ. Technical parameters of BD139Ⅳ. Features of BD139Ⅴ. Working principle of BD139 transistorⅥ. Circuit of BD139 transistor power amplifierⅦ.... -
17 October 2023
IRFP250 Transistor Equivalent, Pin Configuration, Working Principle and More
Ⅰ. Overview of IRFP250Ⅱ. Symbol, footprint and pin configuration of IRFP250Ⅲ. Technical parameters of IRFP250Ⅳ. What are the features of IRFP250?Ⅴ. Working principle of IRFP250Ⅵ. Applications of IRFP250Ⅶ.... -
17 October 2023
A Review of TDA2009A Dual Audio Power Amplifier
Ⅰ. What is TDA2009A?Ⅱ. Symbol, footprint and pin configuration of TDA2009AⅢ. Technical parameters of TDA2009AⅣ. What are the features of TDA2009A?Ⅴ. How does the overheating protection circuit of...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.