Xilinx Inc. XCZU4EV-1FBVB900I

Name: XCZU4EV-1FBVB900I
Brand: Xilinx Inc.
SKU: 3669365-XCZU4EV-1FBVB900I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU4EV-1FBVB900I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669365-XCZU4EV-1FBVB900I

Description:: IC FPGA 204 I/O 900FCBGA

ECAD Model:

Datasheet:: XCZU4EV-1FBVB900I

Specifications

Xilinx Inc. XCZU4EV-1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EV-1FBVB900I.

Factory Lead Time
11 Weeks
Package / Case
900-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EV
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
204
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 192K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Xilinx Inc. is the brand of this part, which is an Embedded - System On Chip (SoC) chip in the Embedded - System On Chip (SoC) category. It has an operating temperature range of -40°C to 100°C TJ and belongs to the Zynq® UltraScale ™ MPSoC EV series. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand 72 hours of exposure. Its HTS Code is 8542.31.00.01 and its Reflow Temperature-Max (s) is not specified. This chip has 204 I/Os and a speed of 500MHz, 600MHz, and 1.2GHz. It also offers connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Its architecture includes both MCU and FPGA, with the primary attribute being the Zynq® UltraScale ™ FPGA with 192K logic cells.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU4EV-1FBVB900I System On Chip (SoC) applications.

Fitness
Industrial transport
Cyberphysical system-on-chip
Networked sensors
Smart appliances
Vending machines
Digital Signal Processing
RISC-V
Microcontroller
Measurement testers

XCZU4EV-1FBVB900I More Descriptions

FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 192K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
MPSOC, ARM CORTEX-A53/R5, FCBGA-900
IC SOC CORTEX-A9 800MHZ 676FCBGA
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-900; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-1FBVB900I

Product Comparison

The three parts on the right have similar specifications to XCZU4EV-1FBVB900I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU4EV-1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 192K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

328

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

yes

-

-

-

-

-

-

-

-

-

-

-

XCZU4EV-1FBVB900I vs XCZU9CG-2FFVB1156E
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

180

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

-

YES

625

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B625

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU4EV-1FBVB900I vs XCZU2EG-L1SFVA625I
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

308

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

XCZU4EV-1FBVB900I vs XCZU19EG-1FFVD1760E