XCZU4EG-L1SFVC784I

Xilinx Inc. XCZU4EG-L1SFVC784I

Part Number:
XCZU4EG-L1SFVC784I
Manufacturer:
Xilinx Inc.
Ventron No:
3669360-XCZU4EG-L1SFVC784I
Description:
IC FPGA 252 I/O 784FCBGA
ECAD Model:
Datasheet:
XCZU4EG-L1SFVC784I

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Specifications
Xilinx Inc. XCZU4EG-L1SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EG-L1SFVC784I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    784-BFBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    784
  • Additional Feature
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.72V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B784
  • Supply Voltage-Max (Vsup)
    0.742V
  • Supply Voltage-Min (Vsup)
    0.698V
  • Number of I/O
    252
  • Speed
    500MHz, 600MHz, 1.2GHz
  • RAM Size
    256KB
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 192K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case of the product is 784-BFBGA, FCBGA, which ensures a compact and efficient design. It is designed to operate in a wide temperature range of -40°C to 100°C, making it suitable for various environments and applications. The packaging is done in trays, which provide a convenient and organized way to handle and transport the product. This particular product was published in 2016, showcasing its modern and up-to-date technology. It utilizes CMOS technology, which is known for its low power consumption and high performance. Although the peak reflow temperature is not specified, the product is designed to withstand extreme temperatures. It is classified under the JESD-30 Code R-PBGA-B784, indicating its compliance with industry standards. The maximum supply voltage is 0.742V, ensuring efficient power usage. With a total of 252 input/output pins, this product offers ample connectivity options. Additionally, it has a RAM size of 256KB, providing sufficient memory for data storage and processing.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU4EG-L1SFVC784I System On Chip (SoC) applications.

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POS Terminals
String inverter
Fitness
ARM
Industrial robot
Functional safety for critical applications in the aerospace
Deep learning hardware
Keyboard
Digital Signal Processing
XCZU4EG-L1SFVC784I More Descriptions
FPGA XCZU4EG Family 192150 Logic Units 192150 Cells 20nm Technology 0.85V 784-Pin FCBGA
Zynq UltraScale RFSoC, Speed Grade-L1, Logic Cells 192K, C784, RoHSXilinx SCT
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 500MHz 600MHz 1.2GHz 0.72V
Microprocessor Circuit, CMOS, PBGA784
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU4EG-L1SFVC784I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    View Compare
  • XCZU4EG-L1SFVC784I
    XCZU4EG-L1SFVC784I
    11 Weeks
    784-BFBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    784
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B784
    0.742V
    0.698V
    252
    500MHz, 600MHz, 1.2GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 192K Logic Cells
    ROHS3 Compliant
    -
  • XCZU7EV-1FBVB900E
    11 Weeks
    900-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    -
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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