Xilinx Inc. XCZU4EG-1FBVB900I
- Part Number:
- XCZU4EG-1FBVB900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669364-XCZU4EG-1FBVB900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- Datasheet:
- XCZU4EG-1FBVB900I
Xilinx Inc. XCZU4EG-1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EG-1FBVB900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 192K Logic Cells
- RoHS StatusROHS3 Compliant
XCZU4EG-1FBVB900I Description
The Zynq® UltraScale ™ MPSoC EG is an advanced series of processors that offer high-speed performance and a wide range of connectivity options. This versatile package is available in 900-BBGA and FCBGA cases, making it suitable for a variety of applications. It has an operating temperature range of -40°C to 100°C TJ, ensuring reliable operation even in extreme environments. The part status is active, indicating that it is currently in production. With a moisture sensitivity level of 4 (72 hours), it can withstand moderate levels of moisture exposure. While the reflow temperature is not specified, the speed of this processor can reach up to 1.2GHz, making it a powerful choice for demanding tasks. The core processor consists of a quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5 with CoreSight™, as well as an ARM Mali™-400 MP2 for graphics processing. In terms of connectivity, it offers a wide range of options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Additionally, it is ROHS3 compliant, ensuring that it meets the latest environmental standards. Overall, the Zynq® UltraScale ™ MPSoC EG is a highly capable and reliable processor that can handle a variety of tasks with ease.
XCZU4EG-1FBVB900I Features
Arm Cortex-A53 Based Application Processing Unit (APU) Dual-core Arm Cortex-R5F Based Real-Time Processing Unit (RPU) On-Chip Memory Arm Mali-400 Based GPU External Memory Interfaces 8-Channel DMA Controller
XCZU4EG-1FBVB900I Applications
Automotive: Driver assistance, driver information, and infotainment Wireless Communications: Support for multiple spectral bands and smart antennas Wired Communications: Multiple wired communications standards and context-aware network services Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics Smarter Vision: Evolving video-processing algorithms, object detection, and analytics Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safety
The Zynq® UltraScale ™ MPSoC EG is an advanced series of processors that offer high-speed performance and a wide range of connectivity options. This versatile package is available in 900-BBGA and FCBGA cases, making it suitable for a variety of applications. It has an operating temperature range of -40°C to 100°C TJ, ensuring reliable operation even in extreme environments. The part status is active, indicating that it is currently in production. With a moisture sensitivity level of 4 (72 hours), it can withstand moderate levels of moisture exposure. While the reflow temperature is not specified, the speed of this processor can reach up to 1.2GHz, making it a powerful choice for demanding tasks. The core processor consists of a quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5 with CoreSight™, as well as an ARM Mali™-400 MP2 for graphics processing. In terms of connectivity, it offers a wide range of options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Additionally, it is ROHS3 compliant, ensuring that it meets the latest environmental standards. Overall, the Zynq® UltraScale ™ MPSoC EG is a highly capable and reliable processor that can handle a variety of tasks with ease.
XCZU4EG-1FBVB900I Features
Arm Cortex-A53 Based Application Processing Unit (APU) Dual-core Arm Cortex-R5F Based Real-Time Processing Unit (RPU) On-Chip Memory Arm Mali-400 Based GPU External Memory Interfaces 8-Channel DMA Controller
XCZU4EG-1FBVB900I Applications
Automotive: Driver assistance, driver information, and infotainment Wireless Communications: Support for multiple spectral bands and smart antennas Wired Communications: Multiple wired communications standards and context-aware network services Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics Smarter Vision: Evolving video-processing algorithms, object detection, and analytics Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safety
XCZU4EG-1FBVB900I More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 192K, B900, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 192K, B900, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU4EG-1FBVB900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU4EG-1FBVB900I11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 192K Logic CellsROHS3 Compliant------------
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11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant-----------
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11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-----------
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