XCZU4EG-1FBVB900I

Xilinx Inc. XCZU4EG-1FBVB900I

Part Number:
XCZU4EG-1FBVB900I
Manufacturer:
Xilinx Inc.
Ventron No:
3669364-XCZU4EG-1FBVB900I
Description:
IC FPGA 204 I/O 900FCBGA
ECAD Model:
Datasheet:
XCZU4EG-1FBVB900I

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Specifications
Xilinx Inc. XCZU4EG-1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EG-1FBVB900I.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    900-BBGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    204
  • Speed
    500MHz, 600MHz, 1.2GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 192K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
XCZU4EG-1FBVB900I Description
The Zynq® UltraScale ™ MPSoC EG is an advanced series of processors that offer high-speed performance and a wide range of connectivity options. This versatile package is available in 900-BBGA and FCBGA cases, making it suitable for a variety of applications. It has an operating temperature range of -40°C to 100°C TJ, ensuring reliable operation even in extreme environments. The part status is active, indicating that it is currently in production. With a moisture sensitivity level of 4 (72 hours), it can withstand moderate levels of moisture exposure. While the reflow temperature is not specified, the speed of this processor can reach up to 1.2GHz, making it a powerful choice for demanding tasks. The core processor consists of a quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5 with CoreSight™, as well as an ARM Mali™-400 MP2 for graphics processing. In terms of connectivity, it offers a wide range of options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Additionally, it is ROHS3 compliant, ensuring that it meets the latest environmental standards. Overall, the Zynq® UltraScale ™ MPSoC EG is a highly capable and reliable processor that can handle a variety of tasks with ease.

XCZU4EG-1FBVB900I Features
Arm Cortex-A53 Based Application Processing Unit (APU) Dual-core Arm Cortex-R5F Based Real-Time Processing Unit (RPU) On-Chip Memory Arm Mali-400 Based GPU External Memory Interfaces 8-Channel DMA Controller

XCZU4EG-1FBVB900I Applications
Automotive: Driver assistance, driver information, and infotainment Wireless Communications: Support for multiple spectral bands and smart antennas Wired Communications: Multiple wired communications standards and context-aware network services Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics Smarter Vision: Evolving video-processing algorithms, object detection, and analytics Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safety
XCZU4EG-1FBVB900I More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 192K, B900, RoHSXilinx SCT
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU4EG-1FBVB900I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    View Compare
  • XCZU4EG-1FBVB900I
    XCZU4EG-1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 192K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    -40°C~100°C TJ
    Tray
    -
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    YES
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B625
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
  • XCZU9EG-1FFVC900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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